RF Component Fabrication with Laser-Annealed Trap-Rich Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing radio frequency components face challenges with parasitic surface conduction, which degrades their performance due to induced currents in the semiconductor substrate.
Innovation Solution
A method involving laser anneal of a semiconductor substrate to create a trap-rich layer, followed by forming an insulating layer and radio frequency components on it, to reduce parasitic currents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional semiconductor substrate is used for RF components, then the manufacturing process is simple, but parasitic surface conduction degrades component performance
Solution Approach 1:
The patent applies preliminary action by performing laser annealing on the semiconductor substrate before fabricating the RF components. This pre-treatment creates a trap-rich layer that captures charge carriers and prevents parasitic surface conduction during subsequent component operation, thereby improving RF component performance without complicating the overall manufacturing process
Solution Approach 2:
The patent converts the harmful effect of parasitic surface conduction into a beneficial outcome by using laser annealing to deliberately create controlled defects and traps in the substrate surface. These traps, which could be considered defects, actually serve to capture charge carriers and reduce unwanted conduction, thus transforming a potential harm into a performance-enhancing feature
2Object-generated harmful factors
If laser anneal is applied to create trap-rich layer, then parasitic currents are reduced, but manufacturing process complexity increases
Solution Approach 1:
The patent replaces complex multi-step chemical or physical treatment processes with a single laser annealing step. The laser process directly creates the desired trap-rich layer through controlled thermal processing, eliminating the need for multiple sequential manufacturing steps and thereby reducing overall process complexity despite the advanced technology involved
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively decreases parasitic currents and improves the performance of radio frequency components by creating a high trap density surface layer using a simple and cost-effective laser anneal technique.
Implementation Method 1
a) a laser anneal of a first thickness of the substrate on the upper surface side of the substrate
Implementation Method 2
during step a), the first thickness of the substrate is melted
Data Source
AI summary
The present description concerns a method of manufacturing a device comprising at least one radio frequency component on a semiconductor substrate comprising: a) a laser anneal of a first thickness of the substrate on the upper surface side of the substrate; b) the forming of an insulating layer on the upper surface of the substrate; and c) the forming of said at least one radio frequency component on the insulating layer.