High-Frequency Connector Assembly With Dual Ground Paths for RF Leakage
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Solution Overview
Problem
Current RF electrical connectors, such as F-type connectors, suffer from RF leakage and ingress issues due to improper tightening, gaps in push-on engagement, variable center pin sizes, and reliability problems like bent pins and corrosion, which degrade RF performance, especially in high-frequency applications.
Innovation Solution
The proposed high-frequency electrical connector features a conductive shell with primary and secondary ground connections that provide separate grounding paths, using spring fingers and dielectric inserts to ensure secure mating and reduced signal leakage, eliminating the need for threads and enhancing reliability with a scoop-proof interface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If threaded engagement is used for connector mating, then mechanical connection strength is improved, but RF leakage occurs due to improper tightening and gaps
Solution Approach 1:
The grounding function is segmented into primary and secondary ground connections, with the secondary ground providing additional RF shielding path independent of the mechanical threading quality, thus addressing RF leakage without compromising mechanical strength
Solution Approach 2:
A secondary ground connection acts as an intermediary RF shielding path between the signal contact and external environment, providing an alternative route for RF signals that bypasses the problematic threaded mechanical connection interface
2Ease of operation
If push-on engagement is used for connector mating, then ease of operation is improved, but RF leakage occurs due to gaps between components
Solution Approach 1:
The secondary ground connection serves as an intermediary RF barrier that fills the functional gap left by push-on engagement, providing continuous RF shielding without requiring precise mechanical contact
3Device complexity
If conventional single ground connection is used, then device complexity is reduced, but RF performance degrades at high frequencies
Solution Approach 1:
The grounding system is divided into primary and secondary ground connections, each serving distinct RF shielding functions that together provide superior high-frequency performance while maintaining manageable structural complexity
Solution Approach 2:
The secondary ground connection adds a new dimension to the grounding architecture, creating a three-dimensional RF shielding network that enhances high-frequency performance beyond what planar single-ground designs can achieve
4Adaptability or versatility
If variable center pin size is used in F-type connectors, then adaptability is improved, but manufacturing precision and RF performance at high frequencies are reduced
Solution Approach 1:
The invention transitions from mechanical adaptability (variable pin sizes) to electrical adaptability through the secondary ground connection, which provides RF performance consistency independent of mechanical dimensional variations
Data Source
AI summary
A connector assembly that includes a receptacle with inner and outer shells which have a front end for mating with a mating connector and a back end configured to connect to a printed circuit board. Receptacle primary and secondary ground connections are located on one of the shells. A plug with an outer shell that supports a pin contact to mate with the socket contact. The outer shell of the plug has a front end for mating with the front end of the receptacle and a back end that is configured to connect to a coaxial cable. Plug primary and secondary ground connections are located on the outer shell. When the receptacle and plug are mated, the primary ground connections form a primary grounding path through the assembly and the secondary ground connections form a secondary grounding path through the assembly, thereby electrically connecting the plug with the board.