RF Connector Insulation Using Low-Temperature Formable Resin
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Solution Overview
Problem
Current RF connector insulative materials, such as glass ceramics, require high processing temperatures that exceed acceptable levels for plated components, leading to damage and long lead times for pre-forms, while also being expensive and having inconsistent dielectric constants over a wide range of frequencies.
Innovation Solution
The use of a formable epoxy phenol novolac based resin, which can be processed at lower temperatures (150°C-380°C) and is thermally cured with an imidazole catalyst, allowing for pre-plated components and hermetic sealing, and is injected between the inner and outer conductors of RF connectors using automated dispensing systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glass ceramic materials are used for insulators and dielectrics, then hermetic sealing capability is improved, but processing temperature requirements exceed acceptable levels for plated connector parts
Solution Approach 1:
The patent changes the material parameter from glass ceramic to epoxy phenol novolac based resin, which allows processing at lower temperatures (150°C-380°C) while maintaining hermetic sealing capability. This parameter change resolves the contradiction by finding a material that achieves the same sealing function without requiring excessive heat that would damage plated components.
Solution Approach 2:
The patent uses composite material formulation (epoxy phenol novolac based resin with imidazole catalyst) that combines the benefits of hermetic sealing with low-temperature processing. The composite nature of the resin system enables both the sealing function and compatibility with pre-plated parts, resolving the temperature-sealing contradiction.
2Adaptability or versatility
If glass pre-forms are stocked for every size dielectric needed, then manufacturing flexibility is improved, but inventory costs and lead times increase
Solution Approach 1:
The patent employs disposable insulative material that can be injected and formed on-demand for each connector assembly. Instead of maintaining inventory of various glass pre-form sizes, the liquid resin is applied directly to each component, eliminating the need to stock multiple pre-form types and reducing lead times while maintaining manufacturing flexibility.
Solution Approach 2:
The patent replaces the mechanical assembly of pre-formed dielectric components with an automated injection dispensing system that deposits liquid resin directly into the connector assembly. This substitution eliminates the need for physical inventory of various pre-form sizes and enables rapid, flexible production without lead time delays.
3Manufacturing precision
If automated dispensing systems are used to inject insulative material, then manufacturing precision is improved, but process complexity increases
Solution Approach 1:
The patent replaces manual or mechanical material application methods with automated injection dispensing systems that use computer-controlled jetting or syringe technology. This substitution improves material placement precision while the automation actually reduces operational complexity by eliminating manual steps, despite the increased sophistication of the dispensing equipment itself.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of RF connectors with consistent dielectric properties similar to glass or ceramic materials but at lower temperatures, avoiding damage to plated components and reducing material costs, while allowing for flexible formation of insulative materials in various sizes and shapes.
Implementation Method 1
The insulative material comprises an epoxy phenol novolac resin, which is heated to a temperature between about 150° C. to about 380° C. The epoxy phenol novolac based resin preferably comprises an imidazole catalyst which is thermally cured.
Implementation Method 2
allowing air bubbles to escape from the outer conductor after the material is injected into the volume and the material is substantially filled into the retention groove; heating the RF connector with the injected material to a temperature between about 150° C. to about 380° C.
Data Source
AI summary
A method for making an RF connector having an outer conductor and an inner conductor includes the steps of plating the outer conductor and the inner conductor of the RF connector with at least one corrosion-resistant metallic material; dispensing and/or injecting a material comprising an epoxy phenol novolac based resin. in a volume between the outer conductor and the inner conductor of the connector; heating the RF connector with the injected material to a temperature between about 150° C. to about 380° C. in a substantially dry nitrogen-based environment; and allowing the RF connector to cool.