RF Connector Module Using Lossy Material for Crosstalk Suppression
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Solution Overview
Problem
Current electrical connectors face challenges in handling high-speed RF signals effectively, particularly in preventing crosstalk and maintaining signal integrity due to the close proximity of conductors, which leads to electrical interference and noise.
Innovation Solution
A low-cost, high-performance RF connector module is developed using a co-planar waveguide structure with customizable impedance, incorporating electrically lossy material to suppress unwanted modes of propagation and provide high isolation between RF signal conductors, and featuring a peripheral shielding arrangement to minimize signal coupling with shields.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conductors are placed close together to increase connector density, then productivity and compactness are improved, but electrical interference and crosstalk between adjacent signal conductors worsen
Solution Approach 1:
The patent introduces an electrically lossy material as an intermediary substance positioned between adjacent signal conductors. This material acts as a mediator that absorbs electromagnetic energy and prevents direct coupling between conductors, thereby reducing crosstalk while allowing the conductors to remain in close proximity for high-density connector design.
Solution Approach 2:
The patent changes the electrical parameters of the medium between conductors by introducing material with specific loss characteristics. By adjusting the electrical properties (loss tangent, permittivity) of the intervening material, the patent optimizes the balance between maintaining conductor proximity for density and suppressing electromagnetic interference for signal integrity.
2Reliability
If shield members are placed adjacent signal conductors to reduce crosstalk, then electrical isolation is improved, but the complexity of the connector structure increases
Solution Approach 1:
The patent extracts the shielding function from traditional metallic shield members and transfers it to the electrically lossy material filling the spaces between conductors. This eliminates the need for separate shield components, reducing structural complexity while maintaining or improving isolation performance through the distributed lossy material.
Solution Approach 2:
The patent creates a homogeneous electromagnetic environment by filling all inter-conductor spaces with the same electrically lossy material. This uniform approach provides consistent isolation across all signal paths without requiring complex, customized shielding structures for each conductor pair, thereby simplifying the overall design.
3Reliability
If traditional metal components are used for shielding, then electrical isolation is improved, but manufacturing cost increases
Solution Approach 1:
The patent replaces expensive, precision-machined metal shield components with a cost-effective electrically lossy material that can be easily integrated into the connector structure. This material substitution significantly reduces manufacturing costs while providing adequate isolation performance for the application requirements.
Solution Approach 2:
The patent employs composite material construction, combining the electrically lossy material with the existing connector housing and conductor assembly. This composite approach achieves the shielding function through material properties rather than complex metal component assembly, reducing both material and manufacturing costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves greater than 90 dB of isolation between RF signal conductors at frequencies above 5 GHz, enabling reliable transmission of RF signals with reduced interference and maintaining signal quality, making it a suitable replacement for conventional coaxial connectors.
Implementation Method 1
incorporating electrically lossy material to suppress unwanted modes of propagation and provide high isolation between RF signal conductors
Implementation Method 2
featuring a peripheral shielding arrangement to minimize signal coupling with shields
Implementation Method 3
A low-cost, high-performance RF connector module is developed using a co-planar waveguide structure with customizable impedance
Data Source
AI summary
An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.