RF Contactor Microstrip Impedance Matching

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Solution Overview

Problem

Existing radiofrequency contactors often fail to match the characteristic impedance of the pin contactor with the testing circuit board, leading to deterioration of radiofrequency signals during inspections of semiconductor devices.

Innovation Solution

A radiofrequency contactor with a microstrip line structure on the testing circuit board, featuring a radiofrequency signal pin contactor, a ground block, and additional side ground conductors, which are strategically positioned and connected to maintain impedance matching and prevent signal deterioration by adjusting the inductance and capacitive components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a pin contactor is used for conduction between electrodes and wiring, then electrical connection is achieved, but the characteristic impedance of the pin contactor does not match the wiring conductor, causing radiofrequency signal deterioration

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidradiofrequency signal deterioration
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a microstrip line structure as an intermediary transmission path between the pin contactor and the wiring conductor. This microstrip line acts as a mediator that transforms the impedance characteristics, allowing the pin contactor (with its fixed impedance) to interface properly with the wiring conductor (with its characteristic impedance), thereby eliminating signal deterioration while maintaining reliable electrical connection.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the transmission path from a direct pin-to-wiring connection to a microstrip line-based path with controllable impedance parameters. By adjusting the microstrip line's geometric parameters (width, thickness, substrate properties), the characteristic impedance can be precisely controlled to match both the pin contactor and wiring conductor, resolving the impedance mismatch problem.

Inventive Principle:
Principle #35Parameter changes

2Adaptability or versatility

If the sizes and shapes of the pin contactor and ground conductor are determined under constraints of the radiofrequency semiconductor device, then the device structure is accommodated, but the characteristic impedance matching between the pin contactor and wiring conductor cannot be achieved

Engineering Contradiction:
Improvedevice structure accommodationVSAvoidcharacteristic impedance matching
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent segments the transmission path into distinct functional sections: the pin contactor section, the microstrip line section, and the wiring conductor section. Each section can be independently designed and optimized - the microstrip line section specifically is designed to provide impedance transformation, allowing the pin contactor and wiring conductor to maintain their device-constrained dimensions while achieving overall impedance matching through the intermediate microstrip line.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS8058892B2Radiofrequency contactor
Publication Date: 2011.11.15 MITSUBISHI ELECTRIC CORP
  • US8058892B2 patent drawing
  • US8058892B2 patent drawing
  • US8058892B2 patent drawing

AI summary

A radiofrequency contactor includes a testing circuit board having a dielectric substrate, a lower ground conductor on a lower surface of the dielectric substrate, and a radiofrequency signal wiring conductor on an upper surface of the dielectric substrate, a radiofrequency signal pin contactor located on the upper surface of the dielectric substrate and connected to the radiofrequency signal wiring conductor, a ground block located on the upper surface of the dielectric substrate and spaced apart from the radiofrequency signal wiring conductor and the radiofrequency signal pin contactor, and a first side ground conductor and a second side ground conductor provided on the upper surface of the dielectric substrate and spaced apart from the radiofrequency signal wiring conductor and the radiofrequency signal pin contactor.