High-Frequency Module RF Control Line Isolation
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Solution Overview
Problem
In high-frequency modules, noise leakage occurs due to the close proximity of RF and control lines on the same substrate, leading to reduced communication quality and reception sensitivity.
Innovation Solution
The RF and control lines are positioned on opposite surfaces of the circuit board, with separate connection electrodes and conductors, ensuring isolation between them, and a shield is provided to further reduce external noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If RF line and control line are disposed within the same plane of the substrate, then device complexity is reduced, but isolation between lines deteriorates leading to noise coupling
Solution Approach 1:
The patent transitions from planar arrangement to three-dimensional arrangement by disposing the RF line on the front surface and the control line on the back surface of the substrate. This spatial separation in the vertical dimension eliminates electromagnetic coupling between the lines while maintaining a compact overall structure, directly resolving the contradiction between structural simplicity and noise isolation.
2Area of stationary object
If RF line and control line are disposed close to each other, then area is reduced, but communication quality deteriorates due to noise leakage
Solution Approach 1:
By utilizing the back surface of the substrate for the control line while keeping the RF line on the front surface, the patent achieves maximum spatial separation with minimal increase in substrate area. This three-dimensional layout maintains compact form factor while ensuring excellent isolation and communication quality.
Solution Approach 2:
The substrate itself acts as an intermediary barrier between the RF line and control line. By routing signals through different surfaces of the substrate, the physical structure provides natural electromagnetic shielding, reducing noise coupling while maintaining area efficiency.
3Ease of manufacture
If RF line and control line are disposed within the same plane, then ease of manufacture is improved, but isolation between lines deteriorates
Solution Approach 1:
The manufacturing process is extended to utilize both surfaces of the substrate, with RF lines formed on the front surface and control lines on the back surface. This approach maintains manufacturing simplicity through standard multi-layer PCB techniques while achieving superior noise isolation that planar arrangements cannot provide.
Data Source
AI summary
A high-frequency module includes a circuit board including wiring patterns, a resin on an active element mounted on the circuit board and a side of the circuit board and sealing the active element, and connection conductors penetrating the resin from a surface of the resin and provided on a top surface of the active element. The active element includes a first connection electrode on a surface facing the circuit board, and a second connection electrode on a top surface opposite to the surface facing the circuit board. The first connection electrode is connected to a wiring pattern on the circuit board, and the second connection electrode is connected to the connection conductor and an outer electrode and is not connected to the wiring pattern.