RF Front-End Control Module for Multi-SIM Mobile Devices
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Solution Overview
Problem
Mobile communications devices face challenges in efficiently controlling a plurality of RF front-end components due to inter-chip frequency coupling and interference, limiting the number of receive and transmit chains that can be implemented on a single die, which is exacerbated by the need for multi-SIM support and carrier aggregation across various frequency bands.
Innovation Solution
A control module allocates and assigns a subset of electronic components to form signal paths between integrated circuits and an antenna element, allowing each IC to control its assigned components, thereby reducing inter-IC communication and optimizing resource utilization based on current, scheduled, and supported transmit and receive resources.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple receive and transmit chains are implemented on a single die to support multi-carrier and multi-SIM requirements, then the device's communication capability is improved, but inter-chip frequency coupling and interference increase
Solution Approach 1:
The patent divides the RF front-end components into multiple separate integrated circuits (RFICs) instead of implementing all chains on a single die. Each RFIC handles specific transmit and receive chains, physically separating the components to eliminate inter-chip frequency coupling and interference while maintaining support for multiple carriers and SIMs through coordinated operation of the segmented ICs.
2Adaptability or versatility
If a plurality of RFICs are provided to handle multiple transmit and receive paths, then the number of supported carriers and SIMs is improved, but the complexity of assigning and controlling electronic components increases
Solution Approach 1:
The patent implements a control module with a unified assignment mechanism that can dynamically allocate and control electronic components across multiple RFICs. This universal control approach allows the same control logic to manage different combinations of components for various carriers and SIMs, reducing the overall complexity despite the increased number of RFICs.
Solution Approach 2:
The patent employs dynamic component assignment where the control module can flexibly allocate electronic components to different RFICs based on current communication requirements. This dynamic reconfiguration capability allows the system to adapt to changing carrier and SIM activation states without requiring fixed, complex wiring and control logic for all possible configurations.
3Adaptability or versatility
If RF front-end components are provided separate from the RFIC, then customization of RF capabilities is improved, but the complexity of controlling and assigning components to multiple RFICs increases
Solution Approach 1:
The patent introduces a control module as an intermediary between the separately provided RF front-end components and the multiple RFICs. This intermediary manages the assignment and control of components, providing a standardized interface that simplifies the complexity of coordinating customizable RF components across multiple integrated circuits while maintaining full customization capability.
Data Source
AI summary
A system for controlling a plurality of electronic components arbitrarily assignable to a plurality of integrated circuits of a mobile communications device is provided. The integrated circuits are capable of processing a radio frequency signal. The system includes a control module configured to allocate a subset of the plurality of electronic components constituting at least one signal path between an integrated circuit of the plurality of integrated circuits and an antenna element of the mobile communications device. The control module is further configured to assign the at least one signal path to the integrated circuit, and to transfer control of at least a part of the subset of the plurality of electronic components constituting the at least one signal path to the integrated circuit.