Passive RF Component Cooling Using Phase Change Material
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Solution Overview
Problem
Traditional heat-sinking methods, such as metal heat sinks, are not feasible for cooling small-scale RF components due to interference with RF reception and transmission, leading to overheating issues that impact performance in guidance systems.
Innovation Solution
A passive cooling system using a non-electrically conductive solid-liquid phase change material (SL-PCM) positioned between active RF components and a thermal expansion chamber, facilitated by pores and wicks for capillary action to transfer heat away from the components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional metal heat sinks are used to cool RF components, then heat dissipation is improved, but RF reception and transmission are interfered with
Solution Approach 1:
The patent changes the material parameter from electrically conductive metal to electrically insulating phase change material, which fundamentally alters the electrical properties while maintaining thermal management capability. This resolves the contradiction by allowing heat dissipation without RF interference.
Solution Approach 2:
The patent utilizes the phase transition properties of phase change materials (PCM) that absorb heat during melting and release heat during solidification. This dynamic phase transition enables passive heat dissipation without requiring electrical conductivity, thus solving the contradiction between cooling effectiveness and RF signal integrity.
2Reliability
If phase change material is used for passive cooling, then RF interference is eliminated, but heat transfer efficiency must be maintained
Solution Approach 1:
The patent introduces a porous substrate as an intermediary structure that enhances heat transfer between the RF component and the phase change material. The porous structure increases the contact area and thermal coupling while the PCM fills the pores to provide phase change cooling, thus maintaining heat transfer efficiency without RF interference.
Solution Approach 2:
The patent employs porous materials as the structural basis for the phase change material, which provides large surface area for heat exchange and facilitates capillary action for PCM distribution. This porous structure ensures efficient heat transfer from the RF component to the PCM while maintaining electrical insulation properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively dissipates heat from RF components without interfering with RF operations, maintaining performance by using SL-PCM to absorb and transfer heat to a thermal expansion chamber, ensuring minimal signal attenuation and efficient thermal management.
Implementation Method 1
a solid-liquid phase change material (SL-PCM) which is non-electrically conductive... changing the phase of the SL-PCM from a solid to a liquid
Implementation Method 2
absorbing thermal energy from at least one active radio frequency component with a solid-liquid phase change material (SL-PCM), changing the phase of the SL-PCM from a solid to a liquid
Implementation Method 3
The SL-PCM is moved to the thermal expansion chamber via capillary action through at least one pore, wick, or a combination thereof
Implementation Method 4
a thermal expansion chamber, where the SL-PCM is positioned between the at least one active radio frequency component and the thermal expansion chamber, and where the liquid phase SL-PCM moves into the thermal expansion chamber
Data Source
AI summary
A cooling system and method for passively cooling a guidance system having at least one active radio frequency component, a solid-liquid phase change material (SL-PCM), and a thermal expansion chamber. The SL-PCM absorbs heat from the active radio frequency component and is converted from a solid phase to a liquid phase. While in liquid phase the SL-PCM is transported into the thermal expansion chamber via capillary action through various structures.