Integrated Waveguide RF Coupling Structure for PCB Signal Transfer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Radio frequency coupling structures between integrated circuit packages and external radiating structures face challenges in minimizing radiation losses while maintaining reproducibility and affordability, as existing techniques struggle to effectively transfer RF signals with sufficient strength.
Innovation Solution
A radio frequency coupling structure is integrated into a multi-layer printed circuit board, utilizing a dielectric layer with a multidimensional array of electrically conductive vias to form an integrated waveguide structure, which guides RF signals between transition structures, eliminating the need for external reflectors and stabilizing performance against manufacturing variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a conductive layer and waveguide are used to transfer RF signals from an integrated circuit package to an external radiating structure, then RF signal transfer is enabled, but radiation losses increase and coupling reproducibility decreases
Solution Approach 1:
The patent extracts the problematic external conductive layer and waveguide structure, replacing them with an integrated RF coupling structure formed directly within the multi-layer printed circuit board. This eliminates the need for separate external components that cause radiation losses and manufacturing variability, achieving both low energy loss and high reproducibility through monolithic integration.
Solution Approach 2:
The patent merges the RF coupling function into the printed circuit board itself by forming conductive vias and dielectric structures that integrate the signal transfer path directly within the board layers. This consolidation eliminates interfaces between separate components, reducing radiation losses and improving coupling reproducibility through unified manufacturing.
2Power
If external reflectors are used to reflect RF power towards the waveguide, then RF signal strength is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines the RF signal reflection and guidance functions into the integrated waveguide structure formed by conductive vias within the printed circuit board. The waveguide geometry itself provides the necessary signal directionality and reflection characteristics, eliminating the need for separate external reflector components and reducing overall device complexity while maintaining RF signal strength.
Solution Approach 2:
The patent introduces an integrated waveguide structure formed by conductive vias as an intermediary element that mediates RF signal transfer within the printed circuit board. This internal waveguide structure replaces external reflectors and antennas, providing controlled signal guidance and reflection through the board's internal geometry rather than requiring complex external assemblies.
3Reliability
If conventional RF coupling techniques are used, then RF signal transfer is achieved, but manufacturing variability affects coupling stability
Solution Approach 1:
The patent merges all RF coupling elements (conductive layers, dielectric structures, signal paths) into a single integrated structure formed through unified printed circuit board manufacturing processes. This monolithic integration eliminates multiple assembly steps and interfaces that contribute to manufacturing variability, ensuring consistent coupling performance across production batches.
Solution Approach 2:
The patent utilizes the printed circuit board's inherent manufacturing parameters (via dimensions, dielectric layer thicknesses, conductor trace geometries) as controlled design variables that can be precisely specified and maintained throughout production. By expressing the RF coupling structure in terms of these well-controlled PCB manufacturing parameters, the design achieves high reproducibility and stability across manufacturing variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances RF signal transfer efficiency and reproducibility by controlling radiation losses and manufacturing variability, achieving stable and cost-effective radio frequency coupling within the multi-layer printed circuit board.
Implementation Method 1
The integrated waveguide structure 30 is arranged to guide the RF signal between the first transition structure 50 and the second transition structure
Implementation Method 2
A radio frequency coupling structure is integrated into a multi-layer printed circuit board, utilizing a dielectric layer with a multidimensional array of electrically conductive vias to form an integrated waveguide structure
Data Source
AI summary
A radio frequency coupling structure is arranged to couple a radio frequency signal between a first side of the radio frequency coupling structure to a second side of the radio frequency coupling structure opposite to the first side. The radio frequency coupling structure comprises a dielectric layer, a first electrically conductive layer comprising a first transition structure, a second electrically conductive layer comprising a second transition structure, and an integrated waveguide structure formed by an array of electrically conductive vias extending through the dielectric layer from the first to the second electrically conductive layer to enclose a portion of the dielectric layer. The portion is arranged to guide the radio frequency signal between the first transition structure and the second transition structure.