RF Device Coplanar Waveguide Assembly Gap
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Solution Overview
Problem
Existing RF devices face a trade-off between ease of assembly and high-frequency performance, as a large gap between the signal lead and ground lead is necessary for assembly but compromises RF performance.
Innovation Solution
The RF device incorporates a chip with vias and hot vias, a signal lead and ground lead on the backside, and signal and ground metal sheets on the topside, forming a GSG structure with large gaps for assembly and a coplanar waveguide structure for enhanced RF performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a large gap is formed between the signal lead and ground lead, then ease of assembly is improved, but RF performance deteriorates
Solution Approach 1:
The patent introduces metal sheets on the top side of the chip to compensate for the large gap between leads on the bottom side. By adding grounding elements in a different spatial dimension (top vs bottom sides), the design maintains RF performance despite the large assembly gap at the bottom.
Solution Approach 2:
The signal lead and ground lead are surrounded by metal sheets that extend over the gap area. The metal sheets are positioned to overlap or extend beyond the lead projections, creating a nested configuration where the metal sheets provide additional grounding coverage that compensates for the large gap between leads.
2Ease of manufacture
If the gap between signal lead and ground lead is increased, then assembly difficulty is reduced, but transmission coefficient deteriorates
Solution Approach 1:
The metal sheets on the top side of the chip provide additional grounding and signal pathways that compensate for the large gap between leads on the bottom side. This dimensional addition maintains transmission coefficients better than -15 dB despite the large assembly gap.
Data Source
AI summary
A radio frequency (RF) device includes a chip comprising a plurality of vias and at least a hot via; a signal lead and a ground lead disposed under a back side of the chip; and a signal metal sheet, a first ground metal sheet and a second ground metal sheet disposed on a top side of the chip. The signal metal sheet crosses over the first gap formed between the signal lead and the ground lead. The first ground metal sheet and the second ground metal sheet are coupled to the ground lead through the plurality of vias. The first ground metal sheet and the second ground metal sheet substantially surround the signal metal sheet.