3D Stacked RF Device Package Antenna Integration
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Solution Overview
Problem
Conventional radio frequency device packages are hindered by the large size of antenna elements, which restricts the design of portable devices like smartphones and smart watches, as they require a significant form factor for embedded radar systems, and the specific ground plane definition on printed circuit boards further complicates design considerations.
Innovation Solution
The integration of antenna elements in a three-dimensional arrangement on the printed circuit board, using laminate layers and conductive materials to form a compact radio frequency device package with optimized transmission lines and antennas, allowing for reduced overall package size and simplified manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If antenna elements are embedded in a chip package of a radio frequency radar system, then the radar system can be integrated in portable devices, but the antenna elements account for a large percentage of the total package size
Solution Approach 1:
The patent transitions from planar antenna layouts to a three-dimensional stacked configuration. Multiple antenna elements are arranged in different layers (first antenna in first laminate layer, second antenna in second laminate layer) with vertical spacing, enabling spatial multiplexing that reduces the horizontal footprint while maintaining integration capability
Solution Approach 2:
The patent embeds multiple antenna elements within a compact stacked structure where antennas are nested in different laminate layers. The first antenna is positioned in the first laminate layer while the second antenna is positioned in the second laminate layer, creating a nested configuration that maximizes space utilization and reduces overall package area
2Reliability
If a specific ground plane definition is required on printed circuit boards, then electromagnetic coupling can be controlled, but design considerations become more complex
Solution Approach 1:
The patent divides the ground plane into separate conductive layers (first ground plane in first laminate layer, second ground plane in second laminate layer) that are spatially segmented and independently controllable. This segmentation allows precise electromagnetic coupling control between antenna elements while simplifying the overall design by providing modular ground plane configurations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a smaller package size and improved bandwidth capabilities, while also providing flexibility in routing transmission lines and phase compensation, independent of the printed circuit board material, thus enhancing the performance of radio frequency devices.
Implementation Method 1
The transmission line is electromagnetically coupled to the antenna
Data Source
AI summary
A semiconductor device package includes an integrated circuit chip comprising a radio frequency device. The radio frequency device includes active circuitry at a first surface of the integrate circuit chip. An antenna substrate is disposed over the first surface of the integrated circuit. The antenna substrate includes a first conductive layer disposed over the first surface of the integrated circuit chip. The first conductive layer includes a first transmission line electrically coupled to the integrated circuit chip. A first laminate layer is disposed over the first conductive layer. The first laminate layer overlaps a first part of the first transmission line. A second conductive layer is disposed over the first laminate layer. The second conductive layer includes a first opening overlapping a second part of the first transmission line. A second laminate layer is disposed over the second conductive layer. A first antenna is disposed over the second laminate layer and overlaps the first opening, the second part of the first transmission line, and the integrated circuit chip.