RF Device Package TSV Interconnect Ground Plane Elimination
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional RF device packages suffer from RF loss and low linearity due to ground planes of wire-bonding RF chips contacting the RF main die, leading to performance degradation.
Innovation Solution
A radio-frequency (RF) device package is fabricated using a semiconductor substrate with a TSV structure, where a thinning process reduces the substrate thickness, and a through hole is formed to eliminate the need for a ground plane, allowing for improved interconnect density and reduced interference from the base.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ground planes of wire-bonding RF chips are designed to contact the RF main die, then electrical connection is achieved, but RF loss increases and linearity performance deteriorates
Solution Approach 1:
The patent extracts and eliminates the ground plane structure from the RF chip package. By removing the ground plane that contacts the RF main die, the harmful RF loss and linearity degradation are eliminated while maintaining necessary electrical connections through alternative interconnect structures.
Solution Approach 2:
Instead of having ground planes contact the RF main die from the front side, the patent inverts the approach by mounting the RF chip on the back side of the base and using through-silicon vias (TSVs) to establish connections, thereby avoiding the harmful ground plane contact while achieving the necessary electrical connectivity.
2Object-affected harmful factors
If the semiconductor substrate thickness is reduced through thinning process, then interference from the base is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent applies preliminary action by performing the substrate thinning process early in the manufacturing sequence, before mounting the RF chip on the base. This preliminary thinning reduces the substrate thickness to minimize interference from the base, and subsequent TSV formation and chip mounting complete the process in an optimized sequence.
Data Source
AI summary
An electronic device package has a base and an electronic device chip mounted on the base. The electronic device chip includes a semiconductor substrate having a front side and a back side, a electronic component disposed on the front side of the semiconductor substrate, an interconnect structure disposed on the electronic component, a through hole formed through the semiconductor substrate from the back side of the semiconductor substrate, connecting to the interconnect structure, and a TSV structure disposed in the through hole. The interconnect structure is electrically connected to the RF component, and a thickness of the semiconductor substrate is less than that of the interconnect structure.