RF Directing Structure Assembly for Semiconductor Packages
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Solution Overview
Problem
The integration of automotive radar systems in vehicles increases the cost of the vehicle due to the complexity of semiconductor devices, and existing semiconductor devices with directing structures are not optimized for efficient RF signal propagation and reliable assembly processes.
Innovation Solution
A semiconductor device with a prefabricated multilayer laminate directing structure affixed over a radiating element using an adhesive, allowing for automated assembly and improved reliability and cost-effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a directing structure is integrated into the semiconductor device package, then RF signal propagation is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines the directing structure with the package substrate by integrating it into the same laminated structure. The directing structure is formed as part of the package substrate's multilayer construction, where conductive layers are patterned to create both the substrate functionality and the directing elements, thereby merging two separate components into one unified structure.
Solution Approach 2:
The package substrate serves multiple functions: it provides mechanical support for the semiconductor die, establishes electrical connections through conductive layers and vias, and simultaneously acts as a directing structure for RF signals. The conductive layers are configured to perform both substrate interconnection and signal direction control, eliminating the need for a separate directing structure component.
2Reliability
If a directing structure is affixed to the radiating element, then RF signal directionality is improved, but assembly complexity and cost increase
Solution Approach 1:
The directing structure is merged with the package substrate in the same laminated construction, eliminating the need for separate assembly steps. The conductive layers are patterned during substrate fabrication to simultaneously create both the substrate interconnections and the directing elements, so no additional affixing or assembly operations are required.
Solution Approach 2:
The directing structure is pre-formed as part of the package substrate fabrication process before final assembly. The conductive layers are patterned and configured during substrate manufacturing to inherently provide the directing functionality, so the directing structure is already in place and requires no separate assembly or attachment operations.
3Reliability
If a multilayer laminate directing structure is used, then RF signal propagation is improved, but manufacturing cost increases
Solution Approach 1:
The directing structure is combined with the package substrate in the same multilayer laminate construction, using the same materials and fabrication processes. The conductive layers, dielectric materials, and lamination steps are shared between the substrate and directing structure, eliminating the need for separate materials and manufacturing operations, thereby reducing overall cost.
Solution Approach 2:
The multilayer laminate structure serves dual purposes: it provides the mechanical and electrical substrate functionality while simultaneously providing the RF directing structure. The conductive layers are configured to perform both substrate interconnection and signal direction control, eliminating the need for additional directing structure components and their associated manufacturing costs.
Data Source
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AI summary
A semiconductor device having a radiating element and a directing structure is provided. The semiconductor device includes a device package. A semiconductor die is coupled to the radiating element integrated in the device package. The directing structure is affixed to the device package by way of an adhesive. The directing structure is located over the radiating element and configured for propagation of radio frequency (RF) signals.