Integrated RF Duplexer Circuit on Glass Substrate for Low-Loss Filtering
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional radio frequency (RF) duplexer circuits in mobile phones face challenges due to large volume, high power consumption, and parasitic parameter variations, which hinder miniaturization and performance consistency, especially with silicon-based substrates having high microwave loss and gallium arsenide-based substrates being expensive.
Innovation Solution
A RF duplexer circuit design featuring low-pass and high-pass filters with series-connected filter sub-circuits and tuning sub-circuits, utilizing inductors and capacitors to filter signals effectively, integrated on a substrate like glass for compact, high-performance, and low-power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If discrete devices are used on radio frequency PCB, then the circuit can be assembled, but the volume is large and power consumption is high
Solution Approach 1:
The patent integrates multiple discrete passive devices (resistors, capacitors, inductors, filters) onto a single radio frequency substrate, forming an integrated passive device module. This merging approach reduces the overall circuit volume while maintaining the necessary functionality, directly addressing the contradiction between compact size and manufacturing ease.
Solution Approach 2:
The integrated passive device is divided into multiple functional sub-circuits (low-pass filter, high-pass filter, band-pass filter) that are coupled in series. Each sub-circuit performs a specific filtering function, allowing the complex filtering task to be segmented into manageable units while achieving the desired signal separation.
2Loss of energy
If silicon-based substrates are used for integrated passive devices, then the cost is low, but the microwave loss is high due to trace impurities
Solution Approach 1:
The patent changes the substrate material parameter from silicon-based to glass-based substrate. This material substitution fundamentally alters the electrical properties, reducing microwave loss caused by trace impurities while maintaining cost-effectiveness. The glass substrate provides better insulation properties without significantly increasing manufacturing cost.
3Reliability
If gallium arsenide-based substrates are used for integrated passive devices, then the performance is excellent, but the cost is expensive
Solution Approach 1:
The patent adopts a cost-effective glass-based substrate alternative to expensive gallium arsenide substrates. While gallium arsenide offers excellent performance, the glass substrate provides sufficient performance for the application at a lower cost, making the solution more economically viable for mass production in mobile devices.
4Reliability
If multiple discrete devices are used, then the filtering function can be achieved, but the number of welding spots is large
Solution Approach 1:
The patent combines multiple discrete passive devices into a single integrated passive device module mounted on the radio frequency substrate. This integration dramatically reduces the number of welding spots and interconnections required, while maintaining the complete filtering functionality through the series-coupled sub-circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves efficient signal filtering across specified frequency bands, enabling compact, high-performance, and low-power RF duplexer circuits that meet the requirements of miniaturized mobile devices.
Implementation Method 1
each of the N first filter sub-circuits is configured to filter out a high frequency signal
Implementation Method 2
each of the M second filter sub-circuits is configured to filter out a low frequency signal
Implementation Method 3
each of the N first filter sub-circuits coupled in series includes a first inductor and a first capacitor coupled in series
Implementation Method 4
each of the N first filter sub-circuits coupled in series includes a first inductor and a first capacitor coupled in series
Data Source
AI summary
The present disclosure provides a radio frequency duplexer circuit and a radio frequency substrate. The radio frequency duplexer circuit includes a first terminal, a second terminal, a third terminal, a low-pass filter, and a high-pass filter. The low-pass filter includes N first filter sub-circuits coupled in series and a first tuning sub-circuit. Among the N first filter sub-circuits coupled in series, a first end of a 1st first filter sub-circuit is coupled to the first terminal, and a second end of a Nth first filter sub-circuit is coupled to the second terminal. The high-pass filter includes M second filter sub-circuits coupled in series and a second tuning sub-circuit. Among the M second filter sub-circuits coupled in series, a first end of a 1st second filter sub-circuit is coupled to the first terminal, and a second end of a Mth second filter sub-circuit is coupled to the third terminal.