RF Filter Assembly With Air Layer to Minimize Insertion Loss
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Solution Overview
Problem
Conventional RF filter assemblies for antennas suffer from excessive insertion loss due to the placement of microstrip line filters within dielectric materials, which increases signal loss and assembly complexity.
Innovation Solution
The RF filter assembly incorporates a ceramic waveguide filter with an air layer-forming pad between the filter board and the microstrip line filter, separating them and minimizing contact with dielectric materials, while using a microstrip line filter exposed on the filter board surface and incorporating an air layer to reduce insertion loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the microstrip line filter is disposed within the PCB for fixing made of dielectric material, then the filter structure is compact and integrated, but the insertion loss of the filter excessively occurs
Solution Approach 1:
The patent divides the filter structure into separate components: the microstrip line filter is separated from the dielectric PCB and positioned on the front surface, with only necessary connection portions contacting the PCB. This segmentation reduces the harmful interaction between the dielectric material and the filter while maintaining structural integration.
Solution Approach 2:
The microstrip line filter is extracted from the interior of the dielectric PCB and repositioned on the front surface. This extraction removes the filter from the harmful dielectric environment, significantly reducing insertion loss while preserving the compact integrated design through strategic positioning and connection.
2Stability of the object's composition
If multiple ceramic waveguide filters are mounted on the main board through a PCB for fixing, then the assembly is stable and secure, but the insertion loss increases due to dielectric material coverage
Solution Approach 1:
The patent segments the mounting structure by introducing an air layer between the ceramic waveguide filters and the dielectric PCB. Multiple filters are mounted with their rear surfaces facing the PCB but separated by air, reducing dielectric interaction while maintaining stable assembly through mechanical support structures.
Solution Approach 2:
An air layer is introduced as an intermediary between the ceramic waveguide filters and the dielectric PCB. This air layer acts as a mediator that reduces the harmful effect of dielectric material on the filters while maintaining the structural stability and secure mounting of the assembly.
3Ease of manufacture
If the microstrip line filter is covered by dielectric material on both sides, then the filter is protected and integrated, but the insertion loss greatly occurs
Solution Approach 1:
The microstrip line filter is extracted from full dielectric coverage and repositioned on the front surface of the PCB. Only the necessary connection portions remain in contact with the dielectric material, while the majority of the filter structure is exposed to air, significantly reducing insertion loss while maintaining manufacturability and integration.
Data Source
AI summary
The present invention relates to an RF filter assembly for an antenna and, particularly, comprises: a plurality of band pass filters (BPFs); a filter board which is arranged to be stacked on the front surface of a main board and which mediate the coupling of the band pass filters for the front surface of the main board; low pass filters (LPFs) intaglio- or embossed-printed on front surface of the filter board; and an air layer formation pad arranged between the filter board and the band pass filters to form a predetermined air layer between the front surface of the filter board and rear surfaces of the band pass filters, and thus the overall performance of a filter product can be improved by minimizing insertion loss of a filter.