RF Filter Module Cavity Packaging for Smaller 5G Front Ends
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Solution Overview
Problem
Traditional radio-frequency front end module packaging methods result in large size, high power consumption, and poor system performance due to the integration of filters, switches, and other components using flip chip, wire bonding, and surface mount technology.
Innovation Solution
A filter radio-frequency module packaging structure that includes a substrate with a packaging circuit, flip-mounted filter chips with a wall structure forming a closed cavity, and non-filter chips electrically connected through flip-mounting or wire bonding, encapsulated with a reduced volume of material using transfer molding, die-casting, injection molding, or vacuum coating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional integrated packaging method using flip chip, wire bonding, and surface mount technology is used to attach filters, switches, and other components to substrate, then radio-frequency front end module can be formed, but the size and thickness become large
Solution Approach 1:
The patent merges the filter chip, cavity structure, and packaging housing into a single integrated component. The filter chip is directly mounted within a cavity formed in the packaging housing, eliminating the need for separate substrates and intermediate mounting structures. This consolidation reduces the overall module size and thickness while maintaining functionality.
Solution Approach 2:
The patent implements a nested structure where the filter chip is positioned within a cavity that is itself embedded in the packaging housing. The cavity acts as a nested space that contains the filter chip, allowing compact arrangement and reducing the overall volume of the packaged module compared to traditional planar mounting approaches.
2Use of energy by moving object
If traditional integrated packaging method is used to attach multiple components to substrate, then radio-frequency front end module can be formed, but power consumption increases
Solution Approach 1:
The patent combines the filter chip and packaging structure into a single integrated unit, reducing the number of interconnection interfaces and bonding wires required. This reduction in interconnection elements directly lowers power consumption associated with signal transmission and electrical bonding, while the simplified structure reduces overall device complexity.
3Reliability
If traditional integrated packaging method is used to attach filters, switches, and other components, then radio-frequency front end module can be formed, but system performance deteriorates
Solution Approach 1:
The patent integrates the filter chip directly into the packaging housing cavity, reducing the number of interconnection interfaces and potential failure points. This direct integration improves signal integrity and system reliability by minimizing parasitic effects from multiple bonding layers, while the streamlined structure reduces packaging complexity.
4Quantity of substance
If traditional integrated packaging method with multiple components is used, then radio-frequency front end module can be formed, but encapsulating material volume increases
Solution Approach 1:
The patent merges the filter chip, cavity, and packaging housing into a compact integrated structure, reducing the overall volume that requires encapsulation. The cavity is formed directly within the packaging housing, eliminating the need for additional encapsulant material to fill gaps between separate components, thus reducing both material volume and encapsulation process complexity.
Data Source
AI summary
A filter radio frequency module packaging structure and a method for manufacturing same is disclosed. A first filter chip of the filter radio frequency module packaging structure comprises a chip main body and a wall structure. The wall structure, the functional surface, and a substrate together define a closed cavity, or the wall structure and the functional surface together define a closed cavity. An encapsulation material wraps the first filter chip.