High-Frequency Filter Module Layout for Electrode Isolation
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Solution Overview
Problem
Existing high-frequency modules experience deteriorated filter characteristics when a mounting substrate and filter are integrated, leading to compromised performance in high-frequency applications.
Innovation Solution
A high-frequency module design that includes a mounting substrate with a first and second main surface, featuring a filter with input/output electrodes and land electrodes, and a plurality of via conductors connected to a ground terminal, which improves filter characteristics by reducing electromagnetic field coupling and enhancing isolation between electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a filter is mounted on a mounting substrate to create a high-frequency module, then the module can be integrated and miniaturized, but the filter characteristics are deteriorated due to electromagnetic field coupling between electrodes
Solution Approach 1:
A ground terminal is introduced as an intermediary element between the first and second land electrodes on the mounting substrate. This ground terminal acts as a mediator that blocks electromagnetic field coupling between the signal-carrying land electrodes, thereby preventing deterioration of filter characteristics while maintaining the integrated module structure
Solution Approach 2:
The electromagnetic field coupling problem is addressed by extracting and isolating the ground reference function into a separate ground terminal element. By positioning this ground terminal between the land electrodes and connecting it to the filter's ground electrode, the harmful electromagnetic coupling is removed from the signal path
2Area of stationary object
If land electrodes are placed close to each other on the mounting substrate for compact design, then the module area is reduced, but electromagnetic field coupling increases and filter characteristics deteriorate
Solution Approach 1:
The ground terminal serves as a protective intermediary positioned between the first and second land electrodes. Even when the land electrodes are placed close together for compact design, this ground terminal intermediary blocks the electromagnetic field coupling, allowing small module area without sacrificing filter performance
Solution Approach 2:
The ground terminal, which might seem like an additional space-consuming element, actually enables compact design by allowing land electrodes to be placed closer together. The ground terminal converts the potential harm of close spacing into a benefit by providing electromagnetic shielding that enables denser integration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed design enhances filter characteristics by suppressing electromagnetic field coupling and improving isolation, resulting in improved attenuation and frequency band performance compared to conventional modules.
Implementation Method 1
The plurality of via conductors is located between the first land electrode and the second land electrode in a plan view parallel to the thickness direction
Data Source
AI summary
A filter includes a first input/output electrode and the second input/output electrode, and is arranged on a first main surface of a mounting substrate. The mounting substrate includes a first land electrode, a second land electrode, a ground terminal, and a plurality of via conductors. The first land electrode is connected to the first input/output electrode. The second land electrode is connected to the second input/output electrode. The ground terminal is located closer to a second main surface side than the first main surface in a thickness direction of the mounting substrate. The plurality of via conductors is arranged between the first main surface and the second main surface, and is connected to the ground terminal. The plurality of via conductors is located between the first land electrode and the second land electrode in a plan view from the thickness direction of the mounting substrate.