RF Module Filter Stacking With Inner-Space Terminal Connection
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Solution Overview
Problem
The existing radio frequency modules experience increased transmission loss due to the longer lengths of transmission and reception wiring, which is a result of the common terminal being routed through one of the mounting boards, leading to a larger footprint and reduced downsizing efficiency.
Innovation Solution
The radio frequency module design includes a configuration where the transmission filter and reception filter are mounted opposite each other between two mounting boards, with the output terminal of the transmission filter and input terminal of the reception filter connected by a conductive member within the inner space, avoiding routing through the boards, thus reducing wiring length and enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the common terminal is arranged on one of the mounting boards and wiring is routed through the mounting board, then the module structure is simplified and ease of manufacture is improved, but the wiring length increases leading to increased transmission loss
Solution Approach 1:
The patent transitions the wiring routing from a two-dimensional path through the mounting board to a three-dimensional path through the inner space between mounting boards. By arranging the transmit filter and receive filter on opposite sides of the inner space and connecting them via conductive members through this third dimension, the wiring length is reduced while maintaining manufacturing simplicity.
2Area of stationary object
If the transmission filter and reception filter are mounted on opposite mounting boards facing each other, then the module footprint is reduced and downsizing is achieved, but the wiring length increases when routed through the mounting boards
Solution Approach 1:
The patent utilizes the third dimension (vertical space between mounting boards) to route the conductive members connecting the filters, rather than routing them through the planar mounting boards. This dimensional transition allows both filters to be positioned on opposite boards for compact footprint while achieving short wiring length through direct vertical connections.
Solution Approach 2:
The conductive members are positioned within the inner space formed between the mounting boards, effectively nesting the wiring path within the module's three-dimensional structure. This nesting approach allows the wiring to be integrated into the vertical arrangement of components rather than extending across the board surfaces.
3Strength
If wiring is routed through the mounting board, then the structural integrity is maintained, but heat dissipation is reduced and electromagnetic coupling increases
Solution Approach 1:
The patent extracts the wiring path from the mounting board structure and relocates it to the inner space between mounting boards. This separation allows the mounting boards to maintain their structural integrity without embedded wiring, while the conductive members in the inner space provide improved heat dissipation and reduced electromagnetic coupling through better thermal pathways and spatial separation.
Data Source
AI summary
A radio frequency module includes: a first mounting board having a first principal surface and a second principal surface; a second mounting board having a third principal surface facing the second principal surface and a fourth principal surface; a transmission filter having a first mounting surface facing the second principal surface and a first top surface; and a reception filter having a second mounting surface facing the third principal surface and a second top surface; wherein the transmission and reception filters overlap at least partially in a plan view of the first and second mounting boards, an output terminal of the transmission filter is arranged on the first top surface, an input terminal of the reception filter is arranged on the second top surface, and the output and input terminals are connected by a conductive member not routed through the first mounting board or the second mounting board.