RF Filter Layout Using Lamina Inductors for Higher Q Integration
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Solution Overview
Problem
Conventional signal receiving apparatuses in mobile terminals face performance issues due to the complexity of interconnections and space occupation in RF front-end modules, particularly when modules are integrated on a bare die, leading to poor overall performance.
Innovation Solution
The signal receiving apparatus includes a filter with at least one capacitor on the bare die and at least one inductor on a lamina, connected to the bare die, improving the quality factor of the inductor and enhancing overall performance by reducing the influence of interconnecting wiring and optimizing space utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If all filter components (capacitors and inductors) are disposed on the bare die, then integration is high, but the quality factor of inductors deteriorates due to interconnecting wiring influence
Solution Approach 1:
The filter components are segmented into two groups: capacitors remain on the bare die while inductors are moved to the lamina. This segmentation allows each component type to be placed in the most suitable location, maintaining high integration for capacitors while protecting inductors from wiring influence by placing them on the lamina where they can achieve higher quality factors.
Solution Approach 2:
The patent transitions from a two-dimensional layout where all components are on the bare die to a three-dimensional arrangement where inductors are placed on the lamina (a different plane/dimension). This dimensional change eliminates the interconnecting wiring issue that plagues planar integrations, as the inductors on the lamina can be directly connected to the bare die through vertical interconnects, reducing parasitic effects and improving quality factor.
2Device complexity
If inductors are disposed on the bare die, then integration is high, but space occupation increases due to interconnecting wiring
Solution Approach 1:
By segmenting the filter components and placing inductors on the lamina rather than the bare die, the patent reduces the space required on the bare die. The inductors on the lamina can be positioned more efficiently and connected through vertical interconnects, reducing the overall space occupation while maintaining integration.
Solution Approach 2:
Moving inductors to the lamina utilizes the third dimension (vertical space) rather than consuming horizontal space on the bare die. This dimensional transition allows for compact integration where inductors can be placed in available space on the lamina and connected to the bare die through vertical pathways, significantly reducing space occupation on the critical bare die area.
3Device complexity
If inductors are disposed on the bare die, then integration is high, but manufacturing cost increases due to complex interconnections
Solution Approach 1:
Segmenting the components into those on the bare die (capacitors) and those on the lamina (inductors) simplifies the manufacturing process. The inductors on the lamina can be manufactured using standard PCB or ceramic substrate techniques, then assembled with the bare die through reliable vertical interconnects, reducing overall manufacturing complexity and cost compared to integrating all components on the bare die.
Solution Approach 2:
The dimensional transition to placing inductors on the lamina enables the use of established, cost-effective manufacturing techniques for substrate-based components. The vertical interconnection method is a standard packaging technique that reduces assembly complexity compared to planar integration, thereby lowering manufacturing costs while maintaining integration benefits.
Data Source
AI summary
A signal receiving apparatus includes a filter, an amplifier, a lamina and a bare die disposed on the lamina. The filter is configured to filter a received signal. The filter includes at least one capacitor and at least one inductor. The at least one capacitor is disposed on the bare die. The at least one inductor is disposed on the lamina. The at least one inductor is connected to the bare die. The amplifier is configured to amplify a signal filtered through the filter. The signal receiving apparatus provided by the disclosure can solve a problem of poor overall performance of a receiving link in some implementations and improve the overall performance of the signal receiving apparatus.