Surface-Mount RF Dielectric Filter Pads for Lower Insertion Loss

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current RF dielectric filters face challenges in balancing size, cost, insertion loss, roll-off speed, spurious rejection, and power handling, with ceramic monoblock filters being low-cost but high-loss, air cavity filters being large and expensive, and dielectric waveguide filters degrading in performance as size decreases.

Innovation Solution

A surface mount RF dielectric filter design featuring a block of dielectric material with elongate conductive strips and U-shaped dielectric regions for RF signal input/output pads, allowing for adjustable coupling and reduced insertion loss, integrated with resonators and bridges for enhanced signal transmission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If ceramic monoblock filters are used, then cost is reduced and manufacturing is simplified, but insertion loss increases and power handling capability decreases

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidinsertion loss
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

The filter combines dielectric material for the filter body with conductive material strips for input/output pads, creating a composite structure that leverages the high dielectric constant of the ceramic for compactness while using conductive strips to minimize insertion loss and improve power handling capability

Inventive Principle:
Principle #40Composite materials

2Loss of energy

If air cavity filters are used, then insertion loss is reduced and rejection is improved, but size increases and cost increases

Engineering Contradiction:
Improveinsertion lossVSAvoidfilter size
Core Design Contradiction:
Loss of energyVSVolume of moving object

Solution Approach 1:

The patent changes the physical parameters by using a dielectric material with high dielectric constant instead of air cavity, allowing the filter to achieve similar performance with significantly reduced size. The conductive strips further optimize the electrical parameters to maintain low insertion loss in the compact structure

Inventive Principle:
Principle #35Parameter changes

3Volume of moving object

If dielectric waveguide filters are made smaller, then size is reduced, but performance degrades

Engineering Contradiction:
Improvefilter sizeVSAvoidfilter performance
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent applies local quality by adding conductive strips specifically at the input and output regions where signal coupling occurs. This localized enhancement improves power handling and reduces insertion loss at critical interfaces without requiring an increase in overall filter size, maintaining performance in the compact configuration

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS11929538B2RF dielectric filter with surface mount RF signal input/output structure
Publication Date: 2024.03.12 CTS CORP
  • US11929538B2 patent drawing
  • US11929538B2 patent drawing
  • US11929538B2 patent drawing

AI summary

A RF dielectric filter comprising a block of dielectric material including top and bottom exterior longitudinal surfaces and side exterior surfaces covered with a layer of conductive material. RF signal input/output pads are located at opposed ends of the block. Each of the RF signal input/output pads comprises a strip of conductive material bridging between the bottom exterior surface and the side exterior surface. A strip or region of dielectric material surrounds all the sides of the elongate strip of conductive material except for one end of the strip of conductive material on the side exterior surface which is in a direct unitary coupling relationship with the remainder of the conductive material on the side exterior surface. In one embodiment, the strip or region of dielectric material is generally U-shaped and can vary in width.