RF Filter Package With Passive Cap for Reduced Footprint
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
RF filters and passive devices occupy significant space, limiting the number of frequencies small wireless devices can operate and communicate at, necessitating a need for smaller form factors and improved integration.
Innovation Solution
A package configuration that integrates an integrated device as a filter with an integrated passive device, utilizing a substrate comprising piezoelectric material and metal layers, and a void between the devices, allowing for a compact form factor and reduced footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If RF filters and passive devices are implemented separately, then filtering functionality is achieved, but device size increases
Solution Approach 1:
The patent combines the RF filter and passive devices into a single integrated device structure, where the filter substrate and passive device substrate are merged through bonding interfaces, eliminating the need for separate discrete components and reducing overall device footprint
Solution Approach 2:
The integrated device structure serves multiple functions simultaneously - the filter substrate provides filtering capabilities while also supporting passive devices, and the bonding interface serves both mechanical attachment and electrical connection purposes, reducing the number of separate components needed
2Adaptability or versatility
If multiple RF filters are included for multi-frequency operation, then frequency versatility increases, but space requirements increase
Solution Approach 1:
Multiple RF filters are integrated onto a single filter substrate, sharing common bonding interfaces and support structures, which reduces the total space required compared to using separate discrete filter components for each frequency
3Ease of operation
If discrete passive devices are used, then circuit functionality is achieved, but footprint increases
Solution Approach 1:
Passive devices are integrated directly onto the filter substrate through the bonding interface, combining what would traditionally be separate discrete components into a single compact integrated structure, thereby reducing footprint while maintaining full circuit functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration provides a compact form factor and reduced footprint while maintaining filtering capabilities, enabling smaller wireless devices to operate at multiple frequencies.
Implementation Method 1
The integrated device includes a substrate comprising a piezoelectric material, and at least one metal layer coupled to a first surface of the first substrate
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A package (200) that includes an integrated device (201), an integrated passive device (203) and a void (215). The integrated device (201) is configured as a filter. The integrated device (201) includes a substrate (210) comprising a piezoelectric material, and at least one metal layer (211) coupled to a first surface of the substrate. The integrated passive device (203) is coupled to the integrated device (201). The integrated passive device (203) is configured as a cap for the integrated device (201). The void (215) is located between the integrated device (201) and the integrated passive device (203).