Integrated RF Filter Stack With Inductor-Capacitor Layering
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Solution Overview
Problem
Existing filter structures in wireless radio frequency communication devices have a relatively large size due to low integration levels, limiting their application range.
Innovation Solution
A filter production method involving the formation of a lamellar stack structure by producing a line structure with inductor elements and a capacitor structure or resonator structure on a substrate, enhancing integration levels and reducing size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If filter structures are produced with conventional production technology, then the filter can be manufactured, but the integrated size becomes relatively large due to low integration level
Solution Approach 1:
The patent combines multiple filter components (substrate structure, line structure with inductor elements, capacitor structure, and resonator structure) into a single integrated filter device. The components are formed on the same substrate in an integrated manner, merging what would traditionally be separate discrete components into one compact unit, thereby improving integration level and reducing overall size.
Solution Approach 2:
The patent implements a nested arrangement where the line structure and capacitor structure are positioned on opposite sides of the substrate structure, with the resonator structure integrated within the substrate. This nested configuration allows components to be arranged in three-dimensional space efficiently, maximizing space utilization and reducing the overall footprint of the filter.
2Adaptability or versatility
If filter structures are produced with conventional production technology, then the filter can be manufactured, but the application range is limited due to relatively large size
Solution Approach 1:
The patent transitions from planar two-dimensional arrangement to three-dimensional stacking configuration. The line structure and capacitor structure are positioned on opposite sides of the substrate structure, utilizing the third dimension (vertical stacking) to reduce the horizontal footprint. This dimensional change enables the filter to maintain functional complexity while minimizing overall size, thereby expanding applicability in space-constrained environments.
Data Source
AI summary
Disclosed are a filter production method and a filter, which relate to the technical field of wireless communication. In the above, the filter production method includes: providing a substrate structure; producing and forming a line structure on at least one side of the substrate structure, wherein the line structure includes at least one line layer, and at least one of the line layers has at least one inductor element; and producing and forming a capacitor structure and/or a resonator structure on the side of the at least one line layer close to the substrate structure and/or away from the substrate structure, wherein the capacitor structure includes at least one capacitor element, and the resonator structure includes at least one acoustic resonator. On the basis of the above method, the problem of relatively large integrated size existing in filters produced according to the prior art can be improved.