RF Filter Die TSV Bonding for Miniaturization
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Solution Overview
Problem
The growing demand for miniaturized electronic products with increased density and operational life in semiconductor devices poses challenges for traditional wire bonding techniques, which are limited in supporting smaller, faster, and more reliable semiconductor packages with reduced thermal profiles.
Innovation Solution
The development of RF filter structures and manufacturing methods involving RF filter dies with conductive bond pads and Through-Substrate-Via (TSV) dies, where the RF filter dies are bonded to TSV dies to create integrated circuits with reduced packaging footprint and minimized signal transmission losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If wire bonding techniques are used to electrically connect semiconductor die to package, then electrical connection is achieved, but the packaging footprint increases and thermal profile worsens
Solution Approach 1:
The patent merges the electrical connection function with the package structure by integrating conductive elements directly into the package substrate. This eliminates the need for separate wire bonding operations, reducing packaging footprint while maintaining electrical connection reliability through direct conductive paths between die pads and package terminals.
Solution Approach 2:
The patent extracts the wire bonding step from the manufacturing process by pre-integrating conductive elements into the package structure during package fabrication. This removes the need for post-die-attach wire bonding operations, reducing both packaging complexity and thermal issues associated with additional bonding layers.
2Temperature
If traditional wire bonding is used for interconnection, then electrical connection is established, but thermal management deteriorates and manufacturing complexity increases
Solution Approach 1:
The patent combines the electrical interconnection function with the package thermal management structure by using the same conductive elements for both purposes. The conductive traces and vias that provide electrical connectivity also serve as thermal pathways, improving heat dissipation while simplifying the manufacturing process by eliminating separate wire bonding steps.
3Area of moving object
If semiconductor die are made smaller to support miniaturization, then product size decreases, but wire bonding capability is exceeded and reliability decreases
Solution Approach 1:
The patent transitions from planar wire bonding to three-dimensional direct bonding by integrating conductive elements vertically within the package substrate. This dimensional change allows smaller die to be connected directly to package terminals through vias and conductive traces, eliminating the need for extended wire bonds and enabling continued miniaturization while maintaining connection reliability.
Data Source
AI summary
A product disclosed herein includes an RF filter die including an RF filter, a front side and a plurality of conductive bond pads conductively coupled to at least a portion of the RF filter, wherein at least a portion of the conductive bond pads is exposed on the front side of the RF filter die. The product also includes a TSV (Through-Substrate-Via) die that includes a plurality of conductive TSV contacts positioned on a back side of the TSV die and at least one conductive TSV (Through-Substrate-Via) structure that is conductively coupled to at least one of the plurality of conductive TSV contacts, wherein the back side of the TSV die is bonded to the front side of the RF filter such that the conductive bond pads on the RF filter die are conductively coupled to corresponding conductive TSV contacts positioned on the back side of the TSV die.