RF Source Frequency Control for Low-Reflection Plasma Processing

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Solution Overview

Problem

Existing plasma processing apparatuses face challenges in reducing the degree of reflection of source radio-frequency power, which affects the efficiency and stability of plasma generation.

Innovation Solution

A plasma processing apparatus with a radio-frequency power supply and bias power supply that adjusts the source frequency and phase difference to minimize reflection by setting specific frequencies and phase relationships in a frequency adjustment cycle, including a maximum and minimum frequency in distinct phases, and interpolating frequencies in other phases.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If source radio-frequency power is provided to generate plasma, then plasma generation is achieved, but reflection of source radio-frequency power occurs reducing efficiency

Engineering Contradiction:
Improveplasma generation efficiencyVSAvoidreflection of source radio-frequency power
Core Design Contradiction:
ProductivityVSLoss of energy

Solution Approach 1:

The patent applies dynamics by making the source frequency adjustable and time-variable. The radio-frequency power supply dynamically changes the source frequency according to a predetermined time series that includes a maximum frequency, minimum frequency, and interpolated frequencies. This dynamic frequency adjustment allows the system to adapt to changing plasma conditions and minimize reflection, thereby improving plasma generation efficiency while reducing energy loss.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent implements parameter changes by modifying the source frequency parameter over time. The system changes the frequency from a fixed value to a time-varying parameter following a specific pattern (maximum frequency at first specific phase, minimum frequency at second specific phase, and interpolated frequencies in between). This parameter transformation enables optimization of power transfer and reduction of reflected power.

Inventive Principle:
Principle #35Parameter changes

2Productivity

If frequency adjustment is implemented to reduce reflection, then plasma generation efficiency improves, but system complexity increases

Engineering Contradiction:
Improveplasma generation efficiencyVSAvoidfrequency control system
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by pre-defining the frequency adjustment pattern before plasma generation begins. The time series including maximum frequency, minimum frequency, and interpolated frequencies is predetermined and stored in advance. During operation, the system simply follows this pre-planned frequency schedule rather than requiring complex real-time calculations, thus reducing computational complexity while maintaining efficiency benefits.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent implements feedback mechanisms to monitor and adjust the frequency settings. By observing plasma conditions and power reflection levels, the system can identify optimal frequency points and adjust the time series parameters accordingly. This feedback loop allows the system to learn and optimize performance over time without requiring overly complex control architecture.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces the degree of reflection of source radio-frequency power, enhancing plasma generation efficiency and stability by optimizing frequency and phase settings.

Implementation Method 1

The radio-frequency power supply generates source radio-frequency power having a source frequency to generate plasma from a gas in the chamber

Methodology Applied
Scientific EffectRadio-frequency power generation: Electromagnetic Induction

Implementation Method 2

generate plasma from a gas in the chamber

Methodology Applied
Scientific EffectPlasma generation: Ionisation

Implementation Method 3

The bias power supply provides an electrical bias to the substrate support to draw ions from plasma in the chamber

Methodology Applied
Scientific EffectIon acceleration: Lorentz Force

Data Source

PatentUS20250273432A1Plasma processing apparatus, power supply system, and method for controlling source frequency
Publication Date: 2025.08.28 TOKYO ELECTRON LTD
  • US20250273432A1 patent drawing
  • US20250273432A1 patent drawing
  • US20250273432A1 patent drawing

AI summary

In a plasma processing apparatus, a bias power supply provides an electrical bias having a waveform cycle to a substrate support. A radio-frequency power supply sets a time series of source frequencies of source radio-frequency power in a frequency adjustment cycle to include a maximum frequency in a first specific phase, a minimum frequency in a second specific phase, and an interpolated frequency in a phase other than at least two specific phases including the first and second specific phases. A phase difference between the frequency adjustment cycle and the waveform cycle is set to reduce a reflection degree of the source radio-frequency power. The radio-frequency power supply changes the maximum frequency in the first specific phase and the minimum frequency in the second specific phase in the time series of the source frequencies in the frequency adjustment cycle in a direction opposite to each other.