RF Front-End Carrier Stack for Compact Signal Routing
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Solution Overview
Problem
Existing RF front-end modules are bulky and inefficient in signal transmission, particularly in compact devices like smartphones, due to the need for multiple discrete components and suboptimal electromagnetic signal transitions.
Innovation Solution
An RF module is developed where the RF front-end functionality is integrated into a component carrier stack, comprising electrically conductive and insulating layers, allowing for a compact and efficient implementation of RF front-end functionalities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple discrete components are used to form the RF front-end module, then the RF front-end functionality can be achieved, but the overall height and size of the system increases
Solution Approach 1:
The patent merges multiple discrete RF front-end components (filters, amplifiers, switches, duplexers, multiplexers) into a single integrated module. The component carrier stack combines these functionalities in one unified structure, eliminating the need for separate surface-mounted components and thereby reducing the overall height while maintaining full RF front-end functionality.
Solution Approach 2:
The patent transitions from a two-dimensional surface-mounted arrangement of discrete components to a three-dimensional stacked architecture. By arranging components vertically within the component carrier stack along the z-axis, the design achieves miniaturization in the height direction while maintaining functional integration.
2Reliability
If externally assembled front-end modules are used, then the RF front-end functionality can be implemented, but the electromagnetic signal transition becomes non-optimal
Solution Approach 1:
The patent combines all RF front-end components and their interconnections into a single integrated module manufactured as one unit. This eliminates the external assembly interfaces between separate components and their mounting structures, thereby optimizing electromagnetic signal transitions by removing discontinuities and improving signal integrity throughout the RF signal path.
3Adaptability or versatility
If the number of electronic components is increased to provide more functionalities, then the product functionality improves, but the heat generation and removal difficulty increase
Solution Approach 1:
The patent integrates multiple electronic components that generate heat into a single compact module with unified thermal management. The component carrier stack provides integrated heat dissipation pathways for all embedded components, allowing efficient heat removal despite the increased functionality and component density within the module.
Data Source
AI summary
There is described a radio frequency module, comprising: i) a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; and ii) a RF front-end functionality that is integrated in the stack. Further, an RF arrangement, a manufacture method and a use are described.