RF Front-End Module with Integrated Power Supply for PCB Area Reduction
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Solution Overview
Problem
Existing radio frequency front-end modules in communication terminals require multiple external power supply chips, leading to high hardware costs and large PCB area occupation, which is inefficient and costly.
Innovation Solution
Integration of a transmitting front-end module with a multifunctional power supply, including a logic control and power management chip, power amplifier chip, and output switch chip, which provides flexible power supply management through a single chip, reducing the need for external power supply chips and optimizing PCB area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external power supply chips are used to provide multiple power supplies for radio frequency front-end, then power supply reliability is improved, but hardware cost and PCB area occupation increase
Solution Approach 1:
The patent combines multiple power supply functions (LDO, DC-DC converter, voltage switching) into a single integrated power supply chip. This chip provides multiple output voltage rails simultaneously, eliminating the need for separate external power supply chips while maintaining reliable power delivery to all radio frequency front-end components.
Solution Approach 2:
The integrated power supply chip performs multiple functions: it acts as both an LDO regulator and a DC-DC converter, provides multiple voltage outputs, and includes voltage switching capability. This multi-functional design replaces what previously required multiple separate chips, reducing PCB area while maintaining power supply reliability.
2Reliability
If external power supply chips are used to provide multiple power supplies for radio frequency front-end, then power supply stability is improved, but hardware cost increases
Solution Approach 1:
The patent integrates LDO, DC-DC converter, and voltage switching functions into a single chip, reducing the total component count and associated hardware costs. The integrated design eliminates the need for multiple external power supply chips while maintaining stable power delivery through coordinated operation of internal modules.
3Adaptability or versatility
If multiple external power supply chips are used, then multiple power supply functions are achieved, but device complexity increases
Solution Approach 1:
The integrated power supply chip provides multiple power supply functions through a single device. It includes LDO for linear regulation, DC-DC converter for efficient voltage conversion, and voltage switching capability, all within one chip. This reduces circuit complexity by eliminating multiple separate components and their interconnections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a reliable power supply with reduced costs and PCB area occupation, ensuring high efficiency and compatibility across various communication modes.
Implementation Method 1
the LDO unit is a linear regulated power supply, an input terminal thereof is connected to the battery voltage port and a ramp control voltage port respectively, and an output terminal thereof is connected to the power amplifier chip
Implementation Method 2
the DC-DC unit includes a buck DC power supply converter and a boost DC power supply converter, or is a buck-boost DC power supply converter
Implementation Method 3
the DC-DC unit includes a buck DC power supply converter and a boost DC power supply converter, or is a buck-boost DC power supply converter
Implementation Method 4
an input terminal of the power amplifier chip is connected to at least one radio frequency signal input port and is configured to amplify a radio frequency input signal from outside
Implementation Method 5
the amplified radio frequency signal is filtered by the filter bank and then outputted to the output switch chip
Data Source
AI summary
Disclosed in the present invention are a transmitting front-end module integrated with a multifunctional power supply and a communication terminal. The transmitting front-end module comprises a logic control and power management chip, at least one power amplifier chip, an output switch chip, and a filter bank, wherein an input end of the logic control and power supply management chip is at least respectively connected to an MIPI control port and a battery voltage port, receives, through the battery voltage port, power supplied by an external battery assembly, and receives a first control signal from a baseband through the MIPI control port, so that the state of an output voltage and a path are controlled to supply power to the power amplifier chip or an external linear power amplifier module, and the working states of the power amplifier chip and the output switch chip are controlled.