RF Front-End Module Integration With Self-Polarized Magnetic Puck
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Solution Overview
Problem
Current methods for integrating magnetic functions into front-end radio frequency transmission and reception modules face challenges such as high manufacturing costs, yield reduction, increased insertion loss, and limitations in power handling and frequency usage due to the use of self-polarized/magnet-free magnetic materials, particularly on semiconductor and dielectric substrates.
Innovation Solution
A front-end radio frequency transmission and/or reception module is proposed, featuring a radio frequency integrated circuit with electrical connection zones and a puck based on self-polarized magnetic material, where a first and second dielectric material form lateral coating layers to maintain the module's components in position, and an RDL redistribution layer connects the puck and integrated circuit, allowing for efficient signal transmission without external magnets or adhesives.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If magnetic material is deposited in a cavity formed in a semiconductor substrate, then integration of magnetic function is achieved, but manufacturing cost increases and yield decreases
Solution Approach 1:
The patent extracts the magnetic material integration from the semiconductor substrate cavity approach and relocates it to a separate support substrate. The magnetic material is deposited on the support substrate, then the assembly is transferred to the semiconductor substrate, avoiding the need to form cavities in the expensive semiconductor substrate and reducing manufacturing complexity and cost.
2Adaptability or versatility
If magnetic material is deposited in a cavity formed in a semiconductor substrate, then integration of magnetic function is achieved, but insertion loss increases
Solution Approach 1:
The patent introduces a support substrate as an intermediary carrier for the magnetic material. This support substrate serves as a mediator that holds the magnetic material in the correct position relative to the semiconductor substrate without requiring cavity formation, thereby maintaining signal integrity and reducing insertion loss.
3Volume of moving object
If substrate thickness is limited, then integration is compact, but magnetic material thickness is limited reducing power handling
Solution Approach 1:
The patent utilizes the support substrate as an additional dimensional space to accommodate thicker magnetic material. By depositing magnetic material on the support substrate before assembly, the system can achieve greater magnetic material thickness without increasing the overall module footprint, thereby enhancing power handling capability while maintaining compact integration.
4Stability of the object's composition
If cavity is etched larger than magnetic material, then mechanical stability is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent performs preliminary deposition of magnetic material on the support substrate before final assembly with the semiconductor substrate. This preliminary action allows the magnetic material to be positioned and stabilized on the support substrate, which then serves as a pre-assembled unit, reducing the complexity of precise cavity formation and alignment during final assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the size, weight, and cost of radio frequency systems by optimizing magnetic function integration, improving power handling, and reducing insertion loss, while maintaining stability under vibrations and varying temperatures.
Implementation Method 1
a puck based on a self-polarized magnetic material
Data Source
Figure 1~3A
Figure 3B~5
Figure 6~8
AI summary
A new integration solution is proposed that enables the fabrication of radio frequency transmit and/or receive front-end modules 1 with integrated radio frequency integrated circuit(s) 11 and integrated self-polarizing magnetic component(s) 20 using Wafer Level Packaging technology. This simple and flexible integration solution allows for the design of high-performance, compact, and low-cost front-end modules.