Compact RF Generator Layout With Vertical PCB Power Combining
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Solution Overview
Problem
High-power RF generators face challenges in compact design and efficient heat management within limited 19/2-inch enclosures, particularly at frequencies below 50MHz, due to the need for multiple power stages and combiners, which requires complex and space-consuming connections for RF signal distribution and cooling.
Innovation Solution
A compact RF generator design utilizing a water-cooled cold plate with RF power stages and combining networks mounted on the same surface, along with an RF distribution element featuring a printed circuit board (PCB) with microstrip or stripline conductors that connect power stages to a combining network, allowing for efficient heat dissipation and reduced footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple RF power stages and combiners are arranged in a conventional distributed layout, then reliable RF signal distribution is achieved, but the device occupies excessive space and cannot fit into 19/2-inch enclosures
Solution Approach 1:
The patent merges the RF distribution function directly into the cooling element structure by integrating conductive paths (such as copper traces or busbars) into the cold plate or heat sink. This eliminates separate RF distribution elements and reduces the number of discrete components, allowing multiple RF power stages and combiners to be mounted on the same cooling structure without requiring additional space for separate connection elements.
Solution Approach 2:
The patent transitions from planar RF signal distribution to three-dimensional integration by utilizing the vertical thickness of the cooling element as an additional dimension. RF conductors are embedded within or on the surfaces of the cooling element, allowing signals to be distributed through the volume of the cooling structure rather than requiring separate planar connection paths, thereby reducing overall device footprint.
2Temperature
If RF power stages are mounted on a cooling element surface, then efficient heat dissipation is achieved, but complex connections are required to distribute RF signals between power stages and combiners
Solution Approach 1:
The patent combines the thermal management function and RF signal distribution function into a single integrated structure. The cooling element serves dual purposes: it dissipates heat from RF power stages through active cooling (water or air cooling) and simultaneously distributes RF signals through integrated conductive paths, eliminating the need for separate RF connection elements between power stages and combiners.
Solution Approach 2:
The cooling element is designed as a multi-functional component that performs both thermal management and RF signal distribution. By embedding RF conductors within the cooling structure, the same physical element accomplishes two critical functions, reducing overall system complexity and component count while maintaining efficient heat dissipation and reliable RF signal transmission.
3Power
If conventional RF distribution elements are used to connect power stages above 2 kW, then sufficient power handling is achieved, but the generator cannot fit into compact 19/2-inch enclosures
Solution Approach 1:
The patent utilizes the third dimension (vertical thickness) of the cooling element to accommodate RF distribution paths. By embedding conductors within the volume of the cooling element rather than arranging them in planar configurations, the design achieves sufficient power handling capability for outputs above 2 kW while minimizing the horizontal footprint to fit within 19/2-inch enclosure dimensions.
Solution Approach 2:
The RF distribution conductors are nested within the cooling element structure itself. The cooling element acts as a container that houses both the thermal management pathways and the RF signal distribution pathways, creating a nested arrangement where one function (RF distribution) is embedded within the structure dedicated to another function (heat dissipation), thereby maximizing space utilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-power output (above 2 kW) in a compact form factor, effectively managing heat and minimizing space requirements by using a compact RF distribution element that maintains signal phase and impedance, facilitating easy assembly and reliable connections.
Implementation Method 1
a water-cooled cold plate with RF power stages and combining networks mounted on the same surface
Implementation Method 2
effectively managing heat dissipation
Implementation Method 3
an RF distribution element featuring a printed circuit board (PCB) with microstrip or stripline conductors that connect power stages to a combining network
Data Source
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AI summary
A Radio Frequency, RF, generator in particular for a plasma application, comprising: a cooling element; at least a first RF power stage having a first output and a second RF power stage having a second output, both being mounted onto the cooling element; an RF combining network mounted onto the cooling element comprising at least a first input and a second input; an RF distribution element, wherein the RF distribution element comprises a printed circuit board, PCB, having a plurality of conductors, wherein the conductors of the RF distribution element are arranged such that the first output of the first RF power stage is connected to the first input of the RF combining network and the second output of the second RF power stage with the second input of the RF combining network, respectively, wherein the PCB of the RF distribution element is arranged perpendicularly to the cooling element.