RF Ground Connector Structure for Uniform PECVD Thin Films

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Solution Overview

Problem

Existing plasma enhanced chemical vapor deposition (PECVD) processes face challenges with non-uniform thin film deposition and particle generation due to non-uniform plasma density and RF return path issues, leading to decreased yield and equipment downtime.

Innovation Solution

A plasma processing chamber with improved RF return path using electrical connectors and bendable portions to provide a stable ground connection for large area substrates, reducing particle generation and equipment downtime.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If traditional RF return path is used for large area substrates, then equipment structure is simple, but plasma density uniformity deteriorates and particle generation increases

Engineering Contradiction:

Improvethin film uniformityVSAvoidRF return path structure

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The RF return path is segmented into multiple electrical connectors distributed across the substrate support, with each connector handling a specific region. This segmentation allows independent optimization of RF return in different areas, improving plasma density uniformity across large substrates without requiring complete redesign of the entire RF system.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the substrate support are equipped with electrical connectors having optimized local characteristics. The bendable portions and tube structures are positioned and configured to provide tailored RF return paths for specific local areas, ensuring optimal plasma uniformity in each region while maintaining overall system manageability.

Inventive Principle:

Principle #3Local quality

2Reliability

If rigid RF grounding structure is used, then electrical connection is stable, but equipment downtime for maintenance increases

Engineering Contradiction:

Improveground connection stabilityVSAvoidequipment downtime

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The electrical connectors incorporate bendable portions that provide dynamic, flexible connections between the substrate support and grounding structures. This dynamic design maintains stable electrical contact while allowing for easier disassembly and reconfiguration, reducing maintenance downtime compared to rigid fixed connections.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The connectors utilize flexible tube structures with bendable portions that maintain electrical connectivity while accommodating movement and facilitating maintenance. These flexible components preserve ground connection stability during operation but can be easily repositioned or replaced when needed, minimizing equipment downtime.

Inventive Principle:

Principle #30Flexible shells and thin films

3Manufacturing precision

If electrical connectors with movable parts are added to improve RF return, then plasma uniformity improves, but particle generation inside chamber increases

Engineering Contradiction:

Improveplasma density uniformityVSAvoidparticle generation

Core Design Contradiction:

Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The electrical connectors are positioned and configured to serve as intermediaries that guide RF current through optimized paths away from the plasma generation zone. The tube structures and bendable portions are arranged to prevent direct interference with plasma, reducing particle generation while maintaining their function of improving plasma uniformity through better RF return.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances plasma uniformity and reduces particle generation, improving process yield and minimizing maintenance downtime by providing a reliable RF return path for large area substrates.

Implementation Method 1

The gas distribution plate is generally connected to a RF power source and the susceptor is typically connected to the chamber body providing a RF current return path

Methodology Applied

Scientific EffectRadio frequency current return: Conduction (electrical)

Implementation Method 2

Plasma enhanced chemical vapor deposition (PECVD) is generally employed to deposit thin films on substrates

Methodology Applied

Scientific EffectPlasma enhanced chemical vapor deposition: Plasma Enhanced Chemical Vapour Deposition

Implementation Method 3

The precursor gas in the vacuum chamber is energized (e.g., excited) into a plasma by applying a radio frequency (RF) power to the chamber

Methodology Applied

Scientific EffectRadio frequency plasma generation: Electromagnetic Induction

Data Source

PatentUS20250354263A1Ground return for thin film formation using plasma

Publication Date: 2025.11.20 APPLIED MATERIALS INC

AI summary

A process kit is provided. The process kit includes: a substrate support; and one or more electrical connectors, each electrical connector attached to the substrate support, each electrical connector including: a tube; a shaft including a rim, the rim positioned inside the tube, the shaft including a first portion above the rim and a second portion below the rim, wherein at least part of the first portion is configured to move outside of the tube, and the second portion is inside the tube; and a seal, wherein the rim directly underlies at least a portion of the seal.