High-Frequency Module Ground Layout to Limit Solder Flow
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Solution Overview
Problem
In high-frequency modules, the existing methods for strengthening the ground between RF terminals often result in excessive solder flow to the ground layer, leading to reduced module height and increased risk of mounting failures due to solder spreading and potential foreign matter entrapment.
Innovation Solution
A high-frequency module design featuring a ground layer with through-holes and bridging parts on the mounting substrate, where the ground terminal is connected to the ground layer via solder bumps, reducing solder flow and enhancing ground connection strength between RF terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a ground layer is formed on the surface and the ground terminal is connected to the ground layer using a solder bump to strengthen the ground between RF terminals, then the ground connection strength is improved, but the amount of solder flowing out to the ground layer increases excessively
Solution Approach 1:
The ground layer is segmented into multiple separate ground electrodes (first ground electrode, second ground electrode, third ground electrode) rather than forming a continuous ground layer. The solder bump connects to these segmented electrodes, which reduces the total surface area available for solder flow while maintaining effective ground connection strength between RF terminals.
Solution Approach 2:
The ground electrodes are strategically positioned at specific locations (first and second locations opposite each other with respect to the ground terminal, and third location between the first and second ground electrodes) to provide localized ground connection strength where needed, rather than using a continuous ground layer that would allow excessive solder flow across the entire surface.
2Strength
If excessive solder flows to the ground layer, then the ground connection is strengthened, but the module height is reduced and mounting failures may occur due to solder spreading and foreign matter entrapment
Solution Approach 1:
By segmenting the ground layer into discrete ground electrodes, the invention confines solder flow to specific localized areas around each electrode rather than allowing solder to spread across a continuous ground layer. This reduces the risk of solder bridging, foreign matter entrapment, and maintains proper module height while ensuring reliable ground connection strength.
Solution Approach 2:
The ground electrodes act as intermediaries between the ground terminal and the mounting substrate, providing controlled solder connection points that ensure reliable electrical connection without the harmful effects of excessive solder flow on a continuous ground layer.
Data Source
AI summary
One possible benefit of the present disclosure is to reduce an amount of solder for the connection between a ground terminal and a ground layer to flow out to the ground layer, while strengthening a ground between two RF terminals. A high-frequency module includes a mounting substrate and a filter. The filter includes a first RF terminal, a second RF terminal, and a ground terminal. The ground terminal is located between the first RF terminal and the second RF terminal in plan view in a thickness direction of the mounting substrate. The mounting substrate has a ground layer on a first principal surface. The ground terminal is formed by a solder bump and connected to the ground layer. The ground layer has a through-hole 115 in contact with the ground terminal.