High-Frequency Module Ground Layout for Simultaneous Transmission Heat

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

High frequency modules with multiple transmission filters connected to a ground electrode experience heat dissipation issues during simultaneous transmission operations, leading to deterioration of module characteristics.

Innovation Solution

A high frequency module configuration with a mounting substrate, components, a resin layer, and a ground electrode, where a third component is strategically placed between the first and second components to prevent simultaneous transmission, thereby reducing thermal interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If multiple transmission filters are connected to a ground electrode to improve heat dissipation, then heat dissipation characteristics are improved, but heat generation interference occurs during simultaneous transmission operations

Engineering Contradiction:
Improveheat dissipation characteristicsVSAvoidheat generation interference
Core Design Contradiction:
TemperatureVSObject-generated harmful factors

Solution Approach 1:

The ground electrode is divided into multiple independent ground electrodes, each connected to a specific transmission filter. This segmentation allows independent heat dissipation paths for each filter, reducing thermal interference between simultaneously operating filters while maintaining effective heat dissipation for each individual component.

Inventive Principle:
Principle #1Segmentation

2Area of stationary object

If transmission filters are arranged closely to reduce module size, then integration density is improved, but thermal interference between filters increases

Engineering Contradiction:
Improvemodule sizeVSAvoidthermal interference
Core Design Contradiction:
Area of stationary objectVSTemperature

Solution Approach 1:

Different regions of the module are assigned different ground electrode configurations tailored to local thermal requirements. Transmission filters experiencing high heat generation are provided with dedicated ground electrodes offering superior thermal pathways, while cooler regions use shared ground electrodes, optimizing thermal management without increasing overall module footprint.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS20240048173A1High frequency module and communication apparatus
Publication Date: 2024.02.08 MURATA MFG CO LTD
  • US20240048173A1 patent drawing
  • US20240048173A1 patent drawing
  • US20240048173A1 patent drawing

AI summary

A high frequency module includes a mounting substrate, a plurality of components, a resin layer, and a ground electrode. The plurality of components include a first component, a second component, and a third component. The first component is any one of a first filter and a first power amplifier. The second component is any one of a second filter and a second power amplifier. A top surface of the first component and a top surface of the second component are connected to the ground electrode. The first component and the second component are configured to be capable of performing simultaneous transmission. The third component is configured not to perform a simultaneous transmission operation together with the first component and the second component. The third component is disposed between the first component and the second component in plan view from a thickness direction of the mounting substrate.