RF Package Header Cooling With Telluride Ground Connection
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Solution Overview
Problem
Current designs for high-speed radio frequency signal transmission components, such as laser diodes, face challenges with impedance jumps and heat reflux, which affect signal reflection and cooling efficiency, particularly at high frequencies.
Innovation Solution
A header with a metallic base body and a thermoelectric cooling element, where the electrical connection to the base body uses a telluride element, such as bismuth telluride, to reduce heat reflux and maintain efficient cooling while minimizing thermal conductivity, allowing for effective radio frequency signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metallic base body is used for the header, then electrical conductivity and structural strength are improved, but heat reflux to the electronic component increases
Solution Approach 1:
A thermoelectric cooling element is introduced as an intermediary between the metallic base body and the electronic component. This mediator actively pumps heat away from the component while allowing electrical connections to pass through the base body, thus resolving the contradiction between using conductive metal and preventing heat reflux to the component.
2Temperature
If a thermoelectric cooling element is added, then cooling efficiency is improved, but device complexity increases
Solution Approach 1:
The thermoelectric cooling element is merged with the header structure itself, integrating the cooling function into the existing package rather than adding a separate external cooling system. This reduces overall device complexity while maintaining effective cooling.
3Stability of the object's composition
If active cooling is implemented, then temperature stability is improved, but impedance impact increases
Solution Approach 1:
The thermoelectric cooling element applies cooling locally at the electronic component interface rather than throughout the entire header. This localized approach maintains temperature stability where needed while minimizing the cooling element's impact on the overall impedance characteristics of the header structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces heat reflux and maintains high data transfer rates by using a thermoelectric cooling system with a low thermal conductivity telluride element, ensuring consistent temperature and efficient heat dissipation without significant attenuation of radio frequency signals.
Implementation Method 1
a thermoelectric cooling element (9) having one side (11) bearing on the base body (5) and an opposite side (13) for mounting the electronic component (3)
Data Source
AI summary
A header, with improved cooling for electronic components for radio frequency signal transmission, for an electronic component for radio frequency data transfer, includes: a metallic base body including a plurality of electrical feedthroughs; a thermoelectric cooling element having one side bearing on the base body and an opposite side for mounting the electronic component; a radio frequency line to the electronic component being on the side for mounting the electronic component, with a ground conductor that is electrically connected to the metallic base body, the electrical connection to the metallic base body including a telluride element.