RF-Immune Sensor Probe for Electrostatic Chuck Temperature Monitoring
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Solution Overview
Problem
Substrate processing systems face challenges in accurately monitoring temperature distribution due to failed temperature sensors, leading to uneven treatment processes and high replacement costs when all sensors in a zone fail.
Innovation Solution
A sensor probe with a small form factor and integrated circuit, shielded from RF interference, is inserted into the substrate support to measure surface temperatures, using a grounded body as a Faraday cage or electromagnetic shielding to reduce interference, and optionally includes redundant temperature sensors for reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If embedded temperature sensors are used in substrate support zones, then temperature monitoring capability is improved, but system reliability deteriorates when sensors fail requiring expensive substrate support replacement
Solution Approach 1:
The temperature sensing function is segmented from the substrate support structure itself. Independent sensor probes with discrete temperature sensors are inserted into the substrate support, allowing the sensing function to be separated and replaced independently from the expensive substrate support base.
Solution Approach 2:
Sensor probes act as intermediary components between the temperature measurement need and the substrate support system. These probes can be inserted and removed independently, serving as a mediator that provides temperature sensing without requiring integration into the substrate support structure itself.
2Reliability
If multiple redundant temperature sensors are embedded in substrate support, then measurement reliability is improved, but device complexity and cost increase
Solution Approach 1:
Multiple temperature sensors are segmented into separate probe units rather than being embedded in the substrate support. Each probe can contain one or more sensors, and the probes themselves are modular, reducing the complexity of integrating multiple sensors into the substrate support structure.
Solution Approach 2:
Instead of embedding multiple sensors directly in the substrate support, the sensing function is copied into separate probe units that can be independently manufactured, tested, and replaced. This simplifies the overall system architecture.
3Reliability
If substrate support is replaced when temperature sensors fail, then measurement reliability is maintained, but loss of time and productivity increase
Solution Approach 1:
The temperature sensing function is segmented into removable probe units that can be replaced independently of the substrate support. When a sensor fails, only the affected probe needs to be replaced, not the entire substrate support, significantly reducing downtime.
Solution Approach 2:
The temperature sensors are extracted from the substrate support structure and placed in separate, removable probes. This extraction allows the sensing components to be replaced independently, avoiding the need to replace the entire substrate support assembly.
4Measurement precision
If substrate support is replaced when temperature sensors fail, then measurement precision is maintained, but manufacturing cost increases
Solution Approach 1:
The temperature sensing function is segmented into separate, replaceable probe units. This segmentation allows the expensive substrate support to be reused while only the relatively inexpensive sensor probes are replaced, significantly reducing manufacturing costs.
Solution Approach 2:
The temperature sensors are extracted from the substrate support and placed in removable probes. This extraction enables the separation of the expensive support structure from the replaceable sensing components, reducing overall system cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sensor probe provides accurate temperature monitoring, reducing the risk of uneven treatment processes and minimizing the need for costly substrate support replacements by ensuring reliable temperature sensing.
Implementation Method 1
A first temperature-sensing integrated circuit mounted at a first end of the printed circuit board
Implementation Method 2
the body may be made of metallic or non-metallic materials and grounded to the baseplate. As a result, the body acts as a Faraday cage and the sensor probe is immune to RF signals
Data Source
AI summary
A sensor probe includes an elongated body defining an inner cavity having an inner diameter. A printed circuit board is configured to be fitted within the inner cavity. A first temperature-sensing integrated circuit mounted at a first end of the printed circuit board. A cap is mounted to a first end of the elongated body adjacent to the first temperature-sensing integrated circuit. A housing is configured to receive a second end of the elongated body, wherein the housing is configured to be mounted to a baseplate of a substrate support.