RF Impedance Matching Structure With Ground Plane Isolation
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Solution Overview
Problem
Existing technologies face challenges in achieving effective impedance matching between RF devices on the same substrate, leading to signal losses and reflected signals.
Innovation Solution
The development of an RF impedance matching device using a photosensitive glass substrate, where angled electrical conduction channels and triangular vias are formed through masking, exposure, crystallization, etching, and coating with metals, creating a structure that reduces mechanical support and maintains a lateral distance from the substrate to minimize signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional PCB trace routing is used for RF signal transmission, then the circuit board layout is simple and easy to manufacture, but signal loss increases and transmission efficiency decreases at high frequencies
Solution Approach 1:
The patent introduces an impedance matching conductive structure as an intermediary component between the RF signal source and destination. This structure includes specific trace routing patterns, ground references, and impedance control features that mediate the signal transmission, reducing signal loss while maintaining manageable board layout complexity through standardized design elements.
Solution Approach 2:
The patent applies parameter changes by controlling trace width, spacing, and layer configuration to achieve specific impedance values (e.g., 50 ohms). By adjusting these geometric parameters, the conductive structure optimizes signal transmission efficiency and reduces energy loss at high frequencies while maintaining compatibility with standard PCB manufacturing processes.
2Reliability
If standard conductive traces are used without impedance control, then manufacturing is easier and less precise, but signal integrity deteriorates and transmission efficiency decreases
Solution Approach 1:
The patent defines specific parameter ranges for trace width, spacing, and layer thickness that achieve target impedance values. These parameter specifications balance manufacturing feasibility with signal integrity requirements, providing clear design guidelines that maintain reliability without demanding extreme manufacturing precision.
Solution Approach 2:
The conductive structure is segmented into distinct functional zones with different trace configurations - such as wide traces for power, narrow controlled-impedance traces for signals, and ground reference planes. This segmentation allows each section to be optimized for its specific function while simplifying the overall manufacturing process through modular design approaches.
3Productivity
If RF circuits are designed for high frequency operation, then transmission efficiency improves, but signal loss and interference increase without proper impedance matching
Solution Approach 1:
The patent optimizes geometric parameters of the conductive traces and spacing to achieve characteristic impedances that match standard RF components (typically 50 ohms). This parameter optimization enables efficient high-frequency transmission by minimizing reflections and standing waves, thereby improving productivity while reducing energy loss through proper impedance matching.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in reduced RF losses, improved signal quality, increased data rates, extended transmission distance, and enhanced battery life by optimizing impedance matching between RF devices.
Implementation Method 1
An impedance matching conductive structure for high efficiency RF circuits is provided. The impedance matching conductive structure may be used to interface a power amplifier with a antenna.
Data Source
Figure 1A~2E-2
Figure 2I~2H
Figure 2J~3A
AI summary
The present invention includes a method of making a RF impedance matching device in a photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF Transmission Line in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.