RF Module Inductor Layout for Low-Coupling Carrier Aggregation
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Solution Overview
Problem
Radio-frequency modules with multiple receive filters and inductors experience deterioration in characteristics during simultaneous communication due to magnetic field coupling/electric field coupling between inductors.
Innovation Solution
A radio-frequency module design where inductors are positioned on a mounting board such that at least one second inductor is placed between two first inductors, and the winding axes of inductors are arranged to minimize electromagnetic coupling, with specific configurations of vertically and horizontally wound inductors to suppress signal leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple inductors are used for simultaneous communication in carrier aggregation, then the communication capability is improved, but magnetic field coupling/electric field coupling between inductors causes deterioration in characteristics
Solution Approach 1:
The patent positions inductors at different heights (z-axis) by mounting some inductors on the front surface and others on the back surface of the substrate. This vertical separation in the third dimension reduces electromagnetic coupling between inductors while maintaining their electrical connectivity for carrier aggregation functionality.
Solution Approach 2:
The patent introduces a ground electrode positioned between inductors that would otherwise be adjacent to each other. This ground electrode acts as an electromagnetic shield, blocking magnetic field coupling and electric field coupling between inductors while allowing the circuit to maintain its carrier aggregation capability.
2Area of stationary object
If inductors are placed close together to reduce device size, then the device compactness is improved, but electromagnetic coupling between inductors increases causing signal leakage
Solution Approach 1:
By utilizing the vertical dimension (mounting inductors on both front and back surfaces of the substrate), the patent achieves compact horizontal layout while maintaining sufficient electromagnetic isolation through vertical separation, thus reducing signal leakage despite close proximity.
Solution Approach 2:
The ground electrode serves as an intermediary shielding element placed between closely-spaced inductors, blocking electromagnetic fields and preventing signal leakage while allowing the inductors to maintain their compact arrangement for space efficiency.
3Ease of manufacture
If inductors are arranged in a conventional layout, then the manufacturing process is simple, but magnetic field coupling deteriorates attenuation characteristics during simultaneous communication
Solution Approach 1:
The patent maintains manufacturing simplicity by using standard surface-mount technology for placing inductors on both surfaces of the substrate, while the vertical arrangement inherently reduces magnetic field coupling and improves signal attenuation characteristics during simultaneous communication operations.
Solution Approach 2:
The ground electrode is integrated into the manufacturing process as a standard PCB ground layer or shield, providing electromagnetic isolation between inductors without adding complex assembly steps, thus maintaining ease of manufacture while improving attenuation characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses signal leakage and improves the attenuation characteristics during simultaneous communication, maintaining the integrity of both receiving and transmitting circuits.
Implementation Method 1
characteristics during simultaneous communication may deteriorate due to magnetic field coupling/electric field coupling of two or more inductors
Implementation Method 2
characteristics during simultaneous communication may deteriorate due to magnetic field coupling/electric field coupling of two or more inductors
Data Source
AI summary
A device that includes plurality of inductors, to include two or more first inductors connected to two or more receive filters corresponding to two or more communication bands included in the first combination among a plurality of receive filters, and two or more second inductors connected to two or more receive filters corresponding to two or more communication bands included in the second combination among a plurality of receive filters. In plan view in a thickness direction of a mounting board, at least one second inductor among the two or more second inductors is positioned between two first inductors among the two or more first inductors.