3D Inductor Assembly for RF Power Amplifier Coupling Loss
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Solution Overview
Problem
Conventional radio frequency power amplifier devices experience significant electromagnetic coupling and efficiency loss due to parallel lead wires causing mutual inductance effects, leading to increased equivalent resistance and reduced output signal power.
Innovation Solution
The implementation of an inductor assembly with a 3D structure, comprising an inductor base and conductive wire, interleaved through holes, is connected between the active device and grounded capacitor device, replacing the equivalent inductance of parallel lead wires to reduce electromagnetic coupling and enhance efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If parallel lead wires are used to connect the active device and grounded capacitor device, then the device structure is simple and easy to manufacture, but electromagnetic coupling occurs causing increased equivalent resistance and signal loss
Solution Approach 1:
The patent transitions from a planar two-dimensional layout to a three-dimensional structure by introducing an inductor assembly with through-holes. The bonding wires are routed through vertical through-holes in the inductor base rather than parallel paths on the substrate surface, adding a vertical dimension to the wire routing. This spatial reconfiguration eliminates the parallel component overlap that causes mutual inductance, reducing electromagnetic coupling and signal loss while maintaining manufacturing feasibility through standard wire bonding processes.
2Device complexity
If parallel lead wires are used to connect the active device and grounded capacitor device, then the device structure is simple, but mutual inductance effects cause reduced power amplifier efficiency
Solution Approach 1:
The patent introduces a three-dimensional inductor assembly with vertical through-holes, transforming the wire routing from a two-dimensional planar arrangement to a three-dimensional configuration. The bonding wires pass through the thickness of the inductor base, creating vertical separation between wire segments and eliminating parallel component overlap. This dimensional transition reduces mutual inductance effects and improves power amplifier efficiency while adding only moderate structural complexity through the inductor base integration.
3Ease of manufacture
If the same lead out direction is used for both bonding wires, then the manufacturing process is simplified, but electromagnetic coupling increases causing output signal loss
Solution Approach 1:
The patent resolves the conflict between manufacturing simplicity and signal quality by introducing vertical through-holes in the inductor base. Both bonding wires can still be manufactured using the same wire bonding process, but they are routed through separate vertical paths through the inductor base thickness. This vertical separation in the third dimension eliminates electromagnetic coupling between the wires while maintaining compatibility with standard wire bonding manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 3D inductor assembly reduces signal loss and improves power amplifier efficiency by up to 2% while maintaining gain, by minimizing electromagnetic coupling and equivalent resistance.
Implementation Method 1
the inductances formed by the third lead wire 13 and the fourth lead wire 14 have mutual inductance effects, causing a strong electromagnetic coupling
Data Source
AI summary
A radio frequency power amplifier device includes an active device, a grounded capacitor device, and an inductor assembly disposed on the grounded capacitor device. The inductor assembly is connected between the active device and the grounded capacitor device. The radio frequency power amplifier device and manufacturing method thereof of the embodiment of the present disclosure connect the inductor assembly between the active device and the grounded capacitor device, which is capable of improving the electromagnetic coupling problem due to the two bonding wires existing the parallel components in the conventional solution, so as to reduce the loss of the output signals, and improve the power amplifier efficiency.