RF Front-End Shielding Between Matching Inductors to Preserve Sensitivity

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Solution Overview

Problem

In mobile communication devices, the proximity of transmitter and receiver components in a compact front-end circuit leads to electromagnetic field coupling, causing harmonic components and intermodulation distortion to flow into the receiver, which reduces reception sensitivity.

Innovation Solution

A radio frequency module configuration with a module board featuring a conductive member between inductance elements of the transmission and reception matching circuits to prevent electromagnetic field coupling, using inductors and capacitors in matching circuits and duplexers to block electromagnetic fields.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the transceiver is implemented in a single module as a compact front-end circuit, then the device size is reduced, but electromagnetic field coupling occurs between inductance components of the transmitter and receiver, causing harmonic components and intermodulation distortion to flow into the receiver and reducing reception sensitivity

Engineering Contradiction:
Improvemodule sizeVSAvoidreception sensitivity
Core Design Contradiction:
Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

A conductive member (shielding plate) is introduced as an intermediary element between the transmitter output matching circuit and the receiver input matching circuit. This shielding plate is connected to ground potential and blocks the electromagnetic field coupling path, preventing harmonic components and intermodulation distortion from the transmitter from affecting the receiver, thus resolving the contradiction between compact size and reception sensitivity

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The module board surface is segmented into distinct transmitter and receiver regions by the conductive shielding plate. This segmentation creates electromagnetic isolation between the transmitter output matching circuit and the receiver input matching circuit, allowing both circuits to coexist in close proximity without mutual interference, thereby enabling compact design while maintaining reception sensitivity

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces harmonic components and intermodulation distortion, thereby preventing deterioration of reception sensitivity in the radio frequency module.

Implementation Method 1

a conductive member mounted on the first principal surface is disposed between the first inductance element and the second inductance element

Methodology Applied
Scientific EffectElectromagnetic field blocking: Faraday Cage

Implementation Method 2

a first transmission power amplifier that amplifies a radio frequency transmission signal

Methodology Applied
Scientific EffectPower amplification: Magnetic Amplifier

Implementation Method 3

a first reception low-noise amplifier that amplifies a radio frequency reception signal

Methodology Applied
Scientific EffectLow-noise amplification: Magnetic Amplifier

Data Source

PatentUS11671132B2Radio frequency module and communication device
Publication Date: 2023.06.06 MURATA MFG CO LTD
  • US11671132B2 patent drawing
  • US11671132B2 patent drawing
  • US11671132B2 patent drawing

AI summary

A radio frequency module includes a module board, a transmission power amplifier, a first inductance element mounted on a first principal surface and connected to an output terminal of the transmission power amplifier, a reception low-noise amplifier, and a second inductance element mounted on a first principal surface connected to an input terminal of the reception low-noise amplifier. In a plan view of the module board, a conductive member mounted on the first principal surface is disposed between the first inductance element and the second inductance element.