Low-Height RF Transmission Line Layout With Reduced Capacitance
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Solution Overview
Problem
Existing electronic devices with high-frequency signal transmission lines face limitations in reducing the height of the transmission line while maintaining desired characteristics, leading to constraints in further height reduction.
Innovation Solution
The configuration includes a first substrate with a signal conductor and ground conductors, and a second substrate with a ground conductor that overlaps the signal conductor, creating a gap between them. This design reduces capacitance and allows for a low-height transmission line with suppressed loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the second substrate includes both signal conductor and ground conductor arranged in the thickness direction, then the high-frequency transmission line characteristics are maintained, but the height of the second substrate cannot be reduced further
Solution Approach 1:
The invention moves the signal conductor from the thickness direction (vertical arrangement with ground conductors) to the planar direction (horizontal arrangement on the first substrate). This dimensional change allows the second substrate to be thin while maintaining transmission line functionality through the gap between the planar signal conductor and the vertical ground conductor.
Solution Approach 2:
The invention separates the signal conductor and ground conductor into different substrates: the signal conductor is placed on the first substrate while the ground conductor is placed on the thin second substrate. This segmentation allows each substrate to be optimized independently, with the second substrate achieving minimal height.
2Length of stationary object
If the gap between the signal conductor and ground conductor is reduced, then the height is reduced, but the capacitance increases affecting impedance control
Solution Approach 1:
By arranging the signal conductor in the planar direction rather than the thickness direction, the invention decouples the height reduction from capacitance increase. The gap can be minimized vertically without increasing parallel plate capacitance, as the conductors are not arranged in parallel in the thickness direction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the height of the high-frequency transmission line while minimizing signal loss, achieving both reduced height and desired impedance.
Implementation Method 1
the capacitance between the first ground conductor and the first signal conductor can be reduced due to the gap between the first ground conductor and the first signal conductor
Data Source
AI summary
An electronic device includes a first substrate and a second substrate. On or in the first substrate, a signal conductor extending in a transmission direction of a high-frequency signal and including a turn portion when viewed in plan is provided. On or in the second substrate, a base overlapping the signal conductor in plan view and including a turn portion while extending along the signal conductor is provided. The base is defined by, for example, a metal plate, has electrical conductivity, and serves as a ground conductor. A gap is provided between the signal conductor and the base having electrical conductivity.