RF Matching Network Control for Plasma Power Wave Transitions

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Solution Overview

Problem

Existing plasma processing apparatuses face challenges in efficiently matching the impedance of radio-frequency power supply with the load impedance, leading to significant reflections during transitions between modulated and continuous radio-frequency power waves.

Innovation Solution

A plasma processing apparatus with a matching device that gradually adjusts load impedance to a target impedance during transitions between modulated and continuous radio-frequency power waves, reducing reflections by smoothly changing the absolute value of the reflectance coefficient.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If modulated radio-frequency power is supplied to the electrode, then plasma processing can be performed with controlled power delivery, but significant reflections occur during transitions between modulated and continuous power waves

Engineering Contradiction:
Improveplasma processing efficiencyVSAvoidpower delivery stability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The matching device performs preliminary impedance adjustment before the transition from modulated to continuous power wave. By detecting the impedance during modulated power supply and pre-adjusting the matching network, the system prepares the impedance match in advance, preventing reflections from occurring when the continuous power wave is applied.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The matching device dynamically adjusts the load impedance in real-time based on the power wave state. The system continuously monitors impedance changes and automatically modifies the matching network parameters, enabling smooth transitions between modulated and continuous power modes without significant reflections.

Inventive Principle:
Principle #15Dynamics

2Loss of energy

If the load impedance is rapidly adjusted to match the target impedance during power wave transitions, then power delivery efficiency improves, but oscillations and instability occur in the plasma generation process

Engineering Contradiction:
Improvepower reflection lossVSAvoidplasma generation stability
Core Design Contradiction:
Loss of energyVSStability of the object's composition

Solution Approach 1:

The system applies periodic modulated power waves with controlled duty cycles. By using alternating periods of high and low power delivery, the system maintains plasma stability while gradually adapting the impedance. The periodic nature allows the plasma to adjust smoothly without abrupt changes that would cause oscillations.

Inventive Principle:
Principle #19Periodic action

Solution Approach 2:

The matching device gradually changes impedance parameters rather than making abrupt adjustments. By controlling the rate of impedance change and using incremental adjustments, the system achieves better power transfer efficiency while maintaining plasma generation stability, avoiding the oscillations that would result from rapid impedance switching.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively minimizes reflections and ensures stable power delivery by aligning impedance, enhancing the efficiency and stability of plasma generation.

Implementation Method 1

Radio-frequency power is applied to the electrodes from the radio-frequency power supply in order to excite the gas supplied in the chamber to generate plasma

Methodology Applied
Scientific EffectRadio-frequency excitation: Electromagnetic Induction

Implementation Method 2

The matching device is configured to match the output impedance of the radio-frequency power supply with the impedance on the load side of the radio-frequency power supply, that is, the load impedance

Methodology Applied
Scientific EffectImpedance matching: Electrical Resistance

Data Source

PatentUS12597586B2Plasma processing apparatus and matching method
Publication Date: 2026.04.07 TOKYO ELECTRON LTD
  • US12597586B2 patent drawing
  • US12597586B2 patent drawing
  • US12597586B2 patent drawing

AI summary

A plasma processing apparatus includes a chamber in which a plasma processing is performed, an electrode that supplies a radio-frequency power to the chamber for the plasma processing; a radio-frequency power supply electrically connected to the electrode, and a matching device connected between the radio-frequency power supply and the electrode. The radio-frequency power supply supplies one of a modulated wave and a continuous wave of a radio-frequency power to the electrode. The modulated wave is generated by alternately increasing or decreasing the power level of the radio-frequency power. The matching device gradually changes a load impedance to a target impedance during a period in which the continuous wave is supplied before or after the power supplied from the radio-frequency power supply to the electrode is switched from one of the modulated wave and the continuous wave to the other.