RF Module 3D Interconnection Layout for Lower Mismatching Loss

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Solution Overview

Problem

Conventional RF modules face increased complexity and mismatching loss due to wiring loss and variation in miniaturization, leading to inefficient interconnection of electronic components.

Innovation Solution

The RF module design includes a module board with first and second electronic components disposed apart and a third component electrically connected to both, extending across them, which reduces wiring length and noise, enhancing electrical characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If multiple electronic components are integrated and miniaturized in an RF module, then the module size is reduced, but mismatching loss due to wiring loss and variation increases

Engineering Contradiction:

Improvemodule sizeVSAvoidmismatching loss

Core Design Contradiction:

Volume of moving objectVSLoss of energy

Solution Approach 1:

The patent transitions from planar wiring to three-dimensional wiring by routing conductors through the thickness direction of the substrate. This vertical interconnection approach shortens the wiring length between components while maintaining compact footprint, thereby reducing mismatching loss without increasing module area.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent embeds conductors within the substrate structure, nesting interconnection paths inside the module volume rather than placing them on the surface. This allows wiring to pass through multiple layers and components, reducing the overall wiring length and associated losses while keeping the module compact.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Adaptability or versatility

If multiple electronic components are integrated in an RF module, then the functionality is enhanced, but the interconnection complexity increases

Engineering Contradiction:

ImprovefunctionalityVSAvoidinterconnection complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The substrate serves multiple functions simultaneously: it provides mechanical support, electrical interconnection, and signal routing. The conductors embedded in the substrate create a universal interconnection network that can connect various components (amplifiers, filters, switches) without requiring separate wiring structures for each connection.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the interconnection function with the substrate structure itself, combining mechanical support and electrical connection into a single integrated platform. This eliminates the need for separate wiring harnesses or complex interconnection structures, simplifying the overall design despite multiple components.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS11729903B2Radio frequency module and communication device

Publication Date: 2023.08.15 MURATA MFG CO LTD

AI summary

A radio frequency module includes: a module board; a first electronic component and a second electronic component that are disposed apart from each other on the module board; and a third electronic component that is electrically connected to both the first electronic component and the second electronic component, and is disposed extending across the first electronic component and the second electronic component.