RF Module 3D Component Layout for Isolation in Compact Packaging
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Solution Overview
Problem
The reduction in size of radio-frequency modules leads to poor isolation between electronic components due to increased mounting density, which affects the performance of mobile communication devices.
Innovation Solution
A radio-frequency module design that includes multiple electronic components such as power amplifiers, low-noise amplifiers, switches, and controllers, strategically disposed on and between module substrates to enhance isolation and reduce size, with external connection terminals on one substrate surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the radio-frequency module is reduced, then the mounting density of electronic components increases, but the isolation between electronic components deteriorates
Solution Approach 1:
The patent transitions from planar arrangement to three-dimensional stacking, placing electronic components on both the first and second opposite surfaces of the module substrate. This vertical arrangement in the thickness direction enables compact integration while maintaining adequate isolation distances between components on different surfaces, effectively resolving the contradiction between miniaturization and isolation.
Solution Approach 2:
The patent divides the module substrate into two functional surfaces, with different types of electronic components strategically placed on each surface. This segmentation allows for optimized component placement and isolation, preventing interference while achieving compact module size.
2Volume of moving object
If electronic components are densely mounted to reduce module size, then the compactness improves, but noise interference between components increases
Solution Approach 1:
By arranging components vertically on opposite surfaces rather than horizontally adjacent to each other, the patent increases the physical separation distance between noisy components like power amplifiers and sensitive components like low-noise amplifiers. This spatial separation in the thickness direction reduces noise coupling while maintaining compact footprint.
Data Source
AI summary
A radio-frequency module includes a module substrate having major surfaces; a module substrate having major surfaces, the major surface being disposed facing the major surface; and plural electronic components disposed between the major surfaces, on the major surface, and on the major surface. The plural electronic components include: a first electronic component including the power amplifier; a second electronic component including a low-noise amplifier; a switch that switches connection and disconnection between a first filter and the power amplifier; and a third electronic component including a PA controller to control the power amplifier or a switch controller to control the switch. The first to third electronic components are separately disposed on the major surface, between the major surfaces, and on the major surface.