Radiofrequency Module Antenna Dielectric Spacing Phase Shift
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing radiofrequency modules face challenges in achieving satisfactory performance at a low cost, with conventional designs often requiring complex manufacturing processes and being prone to damage during production, and they suffer from energy loss due to electromagnetic signals being absorbed by the semiconductor substrate.
Innovation Solution
A radiofrequency module design featuring an antenna assembly on a semiconductor integrated circuit with a dielectric spacing between the antenna and a conductive signal ground plane, where the dielectric spacing comprises a semiconductor layer and a printed circuit board, arranged to achieve a phase shift of 60-120 degrees, allowing constructive interference and enhancing energy radiation without the need for a void in the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a void is created in the semiconductor substrate near the antenna structure to improve antenna emission characteristics, then antenna performance is improved, but manufacturing complexity increases and the substrate becomes more fragile
Solution Approach 1:
The invention extracts the function of improving antenna emission characteristics from the semiconductor substrate itself and relocates it to a separate dielectric layer. By removing the need for voids in the substrate and placing the antenna in a dedicated dielectric layer with appropriate thickness, the manufacturing process is simplified while maintaining antenna performance.
Solution Approach 2:
The invention segments the antenna structure from the semiconductor substrate by placing it in a separate dielectric layer. This segmentation allows the antenna to be optimized independently from the substrate, improving emission characteristics without compromising substrate integrity or increasing manufacturing complexity.
2Loss of energy
If the semiconductor substrate absorbs electromagnetic signals, then signal loss occurs, but adding a complex reflective structure increases device complexity
Solution Approach 1:
The invention converts the harmful effect of the semiconductor substrate absorbing electromagnetic signals into a beneficial reflection mechanism. By placing a conductive layer beneath the dielectric layer containing the antenna, the substrate's absorption is transformed into constructive reflection that enhances antenna radiation efficiency without requiring complex additional structures.
Solution Approach 2:
The invention introduces a dielectric layer as an intermediary between the antenna and the semiconductor substrate. This dielectric layer with controlled thickness acts as a mediator that manages the interaction between the antenna and the substrate, converting potential signal loss into beneficial reflection while maintaining structural simplicity.
3Loss of energy
If a conductive layer is added beneath the antenna to create a signal ground plane, then electromagnetic energy radiation efficiency is improved, but manufacturing steps increase
Solution Approach 1:
The conductive layer beneath the dielectric layer serves multiple functions: it acts as a signal ground plane for the antenna, provides a reflective surface to convert substrate absorption into beneficial reflection, and can serve as part of the overall grounding structure. This multi-functionality improves electromagnetic energy radiation efficiency without significantly increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances electromagnetic energy radiation efficiency, reduces manufacturing complexity and costs, and minimizes the risk of damage during production, while maintaining performance comparable to or exceeding existing solutions.
Implementation Method 1
the dielectric spacing being arranged so that a electromagnetic signal in the frequency band of interest that traverses through the dielectric spacing from the antenna assembly to the conductive layer that forms the signal ground plane experiences a phase shift comprised in a range between 60 and 120 degrees
Implementation Method 2
The dielectric spacing ensures that this reflected electromagnetic signal constructively interferes, as it were, with the radiated electromagnetic signal
Implementation Method 3
The signal ground plane serves as a reflector for this semiconductor-absorbed part of the electromagnetic signal. The signal ground plane provides a reflected electromagnetic signal
Data Source
AI summary
A radio frequency module comprises an antenna assembly on a semiconductor integrated circuit that can transmit an electromagnetic signal in a frequency band of interest, or receive an electromagnetic signal in a frequency band of interest, or both. In the radio frequency module, a conductive layer that forms a signal ground plane. At least one semiconductor layer of the semiconductor integrated circuit forms part of this dielectric spacing. The dielectric spacing is arranged so that an electromagnetic signal in the frequency band of interest that traverses through the dielectric spacing from the antenna assembly to the conductive layer that forms the signal ground plane experiences a phase shift comprised in the range between 60 and 120 degrees.