RF Module Switch Layout for MIMO Antenna Isolation
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Solution Overview
Problem
In Multiple Input Multiple Output (MIMO) wireless communication, securing necessary isolation between antennas is difficult, leading to decreased reception sensitivity.
Innovation Solution
A radio frequency module is designed with a first and second filter having a pass band for Time Division Duplex (TDD) bands, along with low-noise amplifiers and switches configured to improve isolation between antenna connection terminals, allowing for better signal processing and reception sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single die is used to integrate multiple switches for antenna switching, then device complexity is reduced, but isolation between antenna connection terminals deteriorates
Solution Approach 1:
The patent divides the switch functions into separate dies. Specifically, the first switch is formed in a first die and the second switch is formed in a second die, physically separating components that would otherwise be integrated in a single die. This segmentation reduces mutual interference and improves isolation between antenna connection terminals while maintaining manageable device complexity through modular architecture.
Solution Approach 2:
The patent transitions from planar integration within a single die to three-dimensional spatial separation using multiple dies. By distributing switches across different dies and utilizing wiring lines that extend outside the dies for interconnections, the design exploits spatial dimensionality to achieve better isolation between antenna terminals without significantly increasing overall device complexity.
2Ease of manufacture
If multiple switches are integrated in one die, then manufacturing is simplified, but reception sensitivity in MIMO communication deteriorates
Solution Approach 1:
The patent segments the switch implementation across multiple dies (first die for first switch, second die for second switch) to improve reception sensitivity in MIMO communication by reducing mutual interference. Each die can be optimized independently for its specific function while maintaining overall manufacturing efficiency through standardized die designs and assembly processes.
Data Source
AI summary
An RF module includes first and second filters having pass bands corresponding to a TDD band. One low-noise amplifier's input is connected to the first filter and output is connected to a first RF output to provide a TDD band downlink signal. Another low-noise amplifier's input is connected to the second filter and output is connected to a second RF output to provide a TDD band downlink signal. A first switch includes terminals respectively connected to a first antenna connection, the first filter, and an RF input to receive a TDD band uplink signal. A second switch includes terminals respectively connected to a second antenna connection terminal, the second filter, and the RF input. The switches are formed on different dies. The second switch is also connected to the first switch via wiring outside the dies, and the first switch is connected to the RF input via the second switch.