Radio-frequency module with asymmetric columnar electrodes

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Solution Overview

Problem

Existing radio-frequency modules have limited design flexibility due to the placement constraints of semiconductor elements, which can degrade radio-frequency propagation characteristics and hinder size reduction, while maintaining electrical and mechanical performance.

Innovation Solution

A radio-frequency module design featuring a module substrate with columnar electrodes of varying sizes and distributions, allowing for increased flexibility in semiconductor IC placement, reduced module size, and enhanced grounding and signal extraction, without compromising electrical or mechanical performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If vias and lands are distributed along every outer side of the semiconductor element to guarantee electrical and mechanical performance, then reliability is improved, but device complexity increases and area occupied increases

Engineering Contradiction:

Improveelectrical performance and mechanical performanceVSAvoidplacement constraints

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies local quality by differentiating the treatment of different sides of the semiconductor element. Specifically, the first side (RF signal input side) is provided with vias and lands for reliable electrical connection, while the second side (opposite to the first side) is intentionally left without vias and lands. This localized differentiation maintains necessary reliability for signal transmission while reducing overall device complexity and placement constraints.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent segments the semiconductor element into functionally distinct sides with different via and land configurations. The first side receives full via and land coverage for electrical performance, while the second side is excluded from such structures. This segmentation allows the device to meet reliability requirements for critical functions while reducing complexity in non-critical areas.

Inventive Principle:

Principle #1Segmentation

2Strength

If vias and lands are distributed along every outer side of the semiconductor element to ensure mechanical performance, then strength is improved, but area occupied increases

Engineering Contradiction:

Improvemounting strengthVSAvoidmodule size

Core Design Contradiction:

StrengthVSArea of stationary object

Solution Approach 1:

The patent applies local quality by concentrating vias and lands only on the first side of the semiconductor element where they are most needed for mechanical support and electrical connection. The second side is deliberately left without these structures, reducing the overall area occupied by the module while maintaining sufficient mounting strength through the strategic placement on the critical first side.

Inventive Principle:

Principle #3Local quality

3Reliability

If the semiconductor element is surrounded by vias and lands on all sides to guarantee electrical performance, then reliability is improved, but the degree of freedom in placement is limited

Engineering Contradiction:

Improveradio-frequency operation and noise immunityVSAvoidplacement flexibility

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent applies local quality by providing vias and lands only on the first side of the semiconductor element where radio-frequency signals are input and where noise immunity is most critical. The second side is left without these structures, which maintains electrical performance for the critical RF functions while significantly increasing placement flexibility and design freedom.

Inventive Principle:

Principle #3Local quality

4Reliability

If vias of the same diameter are distributed along every outer side of the semiconductor element to ensure noise immunity, then reliability is improved, but area occupied increases

Engineering Contradiction:

Improvenoise immunityVSAvoidcircuit board area

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent applies local quality by concentrating noise immunity measures (vias and lands) only on the first side of the semiconductor element where RF signals are input and most susceptible to noise. The second side is left without these structures, reducing the area occupied on the circuit board while maintaining noise immunity for the critical RF signal path.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS11348887B2Radio-frequency module and communication device

Publication Date: 2022.05.31 MURATA MFG CO LTD

AI summary

A radio-frequency module includes: a module substrate having first and second main surfaces; a semiconductor IC having third and fourth main surfaces and mounted on the first main surface with the third main surface between the module substrate and the fourth main surface; and first and second electrodes extending perpendicularly to the first main surface. The cross-sectional area of the second electrodes is smaller than the cross-sectional area of the first electrodes. The semiconductor IC viewed in plan has first and second sides parallel to each other and third and fourth sides parallel to each other. The first electrodes are distributed over a first region between the first side and a side facing the first side and a second region between the second side and a side facing the second side. The second electrodes are in a third region between the third side and a side facing the third side.