Multiband RF Module Board Layout for Size and Signal Isolation

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Solution Overview

Problem

The existing radio frequency modules face challenges in size reduction due to the need for multiple power amplifiers to support multiband technology, leading to increased module size and potential interference that degrades signal quality.

Innovation Solution

A radio frequency module design with power amplifiers for different frequency bands placed on opposite sides of a module board, utilizing a switch to connect output terminals and minimize signal leakage, along with optimized placement of output transformers and filters to reduce size and improve signal quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple power amplifiers are added to support multiband technology, then frequency band coverage is improved, but module size increases

Engineering Contradiction:

Improvefrequency band coverageVSAvoidmodule size

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

Multiple power amplifiers handling different frequency bands are disposed on the same first principal surface of the module board, merging their spatial occupation into a single plane rather than requiring separate layers or distributed arrangements, thereby reducing overall module size while maintaining multiband capability

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent utilizes the vertical dimension by disposing components on opposite principal surfaces of the module board (first and second principal surfaces), effectively using the thickness dimension to separate functionally related components (power amplifiers on first surface, switches on second surface) without increasing the planar footprint

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If multiple power amplifiers are disposed close together, then module size is reduced, but signal interference increases

Engineering Contradiction:

Improvemodule sizeVSAvoidsignal interference

Core Design Contradiction:

Area of stationary objectVSObject-generated harmful factors

Solution Approach 1:

The module board is divided into functional zones with power amplifiers disposed on the first principal surface and switches disposed on the second principal surface, creating spatial segmentation that reduces electromagnetic interference while maintaining compact form factor

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The module board itself acts as an intermediary structure between power amplifiers and switches, with the board's substrate providing electromagnetic isolation and the switch placement on the opposite surface minimizing direct interference paths while enabling compact integration

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS11881876B2Radio frequency module and communication device

Publication Date: 2024.01.23 MURATA MFG CO LTD

AI summary

A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a first power amplifier disposed on the first principal surface and configured to amplify a transmission signal in a first frequency band; a second power amplifier disposed on the first principal surface and configured to amplify a transmission signal in a second frequency band different from the first frequency band; and a switch disposed on the second principal surface and connected to an output terminal of the first power amplifier and an output terminal of the second power amplifier.