RF Module Board Stacking for Transmission-Reception Isolation
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Solution Overview
Problem
In radio frequency modules for mobile communication devices, the arrangement of power amplifiers, low-noise amplifiers, and antenna switches on the same plane leads to decreased transmission-reception isolation due to signal leakage between transmission and reception paths.
Innovation Solution
The module design separates transmission-only, reception-only, and dual-use components across different main surfaces and layers of module boards, preventing signal leakage by strategically mounting these components on opposing surfaces and layers, thereby enhancing isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If transmission-only, reception-only, and dual-use components are arranged on the same plane of the wiring board, then the device complexity is reduced and manufacturing is simplified, but the transmission-reception isolation decreases due to signal leakage between transmission and reception paths
Solution Approach 1:
The patent applies dimensionality change by transitioning from a two-dimensional planar arrangement to a three-dimensional stacked configuration. Transmission-only components are mounted on the first main surface, reception-only components on the second main surface, and dual-use components in the inner layer of the wiring board. This spatial separation across different dimensions effectively isolates transmission and reception signal paths, preventing signal leakage while maintaining a compact form factor.
Solution Approach 2:
The patent segments the wiring board into distinct functional zones: the first main surface for transmission-only components, the second main surface for reception-only components, and the inner layer for dual-use components. This segmentation creates physical separation between transmission and reception paths, eliminating signal interference while organizing components by functional category for easier manufacturing and maintenance.
2Reliability
If components are separated onto different main surfaces and layers, then transmission-reception isolation improves, but the manufacturing process becomes more complex
Solution Approach 1:
The wiring board is designed with multi-functionality to accommodate different component types on different surfaces and layers. The board structure itself serves multiple purposes: providing mechanical support, establishing electrical connections through conductive patterns in inner layers, and enabling thermal management. This universal design simplifies manufacturing by integrating multiple functions into a single platform rather than requiring separate specialized substrates.
Solution Approach 2:
The patent employs a nested structure where the inner layer containing dual-use components is embedded within the wiring board, sandwiched between the first and second main surfaces. This nesting approach allows compact integration of multiple functional layers while maintaining a unified external form factor, simplifying the overall assembly process and reducing the number of discrete components that need to be handled during manufacturing.
3Area of stationary object
If components are densely packed on the same surface, then the module size is reduced, but signal leakage between transmission and reception paths increases
Solution Approach 1:
The patent resolves the conflict between compact size and signal isolation by utilizing the third dimension (vertical stacking). Instead of expanding the module area horizontally to separate transmission and reception components, the design stacks components vertically across different surfaces and layers. This maintains a small footprint while achieving effective signal isolation through spatial separation in the vertical dimension.
Solution Approach 2:
The wiring board itself acts as a flexible structural shell that enables three-dimensional component placement. By utilizing the board's thickness and multiple surfaces, the design creates natural shielding and separation between transmission and reception paths without requiring additional bulky shielding structures, thus maintaining compact dimensions while ensuring signal isolation.
Data Source
AI summary
A radio frequency module includes a power amplification element, a transmission filter, and a transmission matching element, which are transmission-only components for processing only a transmission signal, a low noise amplification element, a reception filter, and a reception matching element, which are reception-only components for processing only a reception signal, an antenna switch, which is a transmission-reception dual-use component for processing both a transmission signal and a reception signal, and a first module board and a second module board, which are arranged to face each other. The transmission-only components are mounted on a main surface of the first module board, and the reception-only components and the transmission-reception dual-use component are mounted on respective main surfaces of the second module board.