RF Module Capacitor Layout for Power Supply Noise Reduction
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Solution Overview
Problem
Conventional radio-frequency modules fail to achieve adequate noise reduction using bypass capacitors in power supply paths, particularly in multiband operation scenarios.
Innovation Solution
The proposed radio-frequency module incorporates a module substrate with electronic components arranged such that a capacitor is strategically positioned between the power supply terminal and the active circuit, reducing impedance and enhancing noise reduction by shortening the connecting wire, thereby improving the effectiveness of bypass capacitors in double-sided mounting configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If bypass capacitors are used in power supply paths, then noise reduction should be improved, but adequate noise reduction is not achieved in conventional configurations
Solution Approach 1:
The capacitor is positioned specifically adjacent to the active circuit on the same major surface, creating a localized noise filtering zone where the capacitor directly shunts high-frequency noise to ground before it can propagate through the power supply path. This localized approach enhances noise reduction effectiveness at the critical point near the active circuit.
Solution Approach 2:
The invention transitions from conventional single-sided mounting to double-sided mounting configuration, utilizing both major surfaces of the substrate. By placing the capacitor adjacent to the active circuit on the same major surface where the active circuit is disposed, the design exploits the three-dimensional spatial arrangement to minimize current loop area and reduce impedance, thereby improving noise reduction performance.
2Ease of manufacture
If capacitors are positioned farther from active circuits in conventional layouts, then manufacturing is simplified, but impedance increases and noise reduction effectiveness decreases
Solution Approach 1:
The capacitor is positioned specifically adjacent to the active circuit on the same major surface, creating a localized noise filtering zone where the capacitor directly shunts high-frequency noise to ground before it can propagate through the power supply path. This localized approach enhances noise reduction effectiveness at the critical point near the active circuit.
3Quantity of substance
If double-sided mounting configuration is used, then component density increases, but noise reduction using bypass capacitors remains inadequate
Solution Approach 1:
The capacitor is positioned specifically adjacent to the active circuit on the same major surface, creating a localized noise filtering zone where the capacitor directly shunts high-frequency noise to ground before it can propagate through the power supply path. This localized approach enhances noise reduction effectiveness at the critical point near the active circuit.
Solution Approach 2:
The invention transitions from conventional single-sided mounting to double-sided mounting configuration, utilizing both major surfaces of the substrate. By placing the capacitor adjacent to the active circuit on the same major surface where the active circuit is disposed, the design exploits the three-dimensional spatial arrangement to minimize current loop area and reduce impedance, thereby improving noise reduction performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively enhances noise reduction by reducing the impedance of the connecting wire, leading to improved performance in noise mitigation within the radio-frequency module.
Implementation Method 1
a capacitor coupled between a path connecting the external connection terminal for power supply to the active circuit and ground
Data Source
AI summary
A radio-frequency module includes a module substrate including a first major surface opposite to a second major surface, a plurality of electronic components disposed at the first major surface and at the second major surface, and a power supply terminal disposed at the second major surface. The plurality of electronic components include an integrated circuit disposed at the second major surface and including a control circuit coupled to the power supply terminal. The plurality of electronic components also include a capacitor disposed at the second major surface and coupled between a path connecting the power supply terminal to the control circuit and ground. The integrated circuit is disposed closer to the capacitor than any other electronic component disposed at the second major surface and/or the capacitor is disposed closer to the integrated circuit than any other electronic component disposed at the second major surface.