RF Module Capacitor Placement for Noise Reduction
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Solution Overview
Problem
Existing radio-frequency modules fail to effectively reduce noise in power supply paths, particularly in multiband operation scenarios.
Innovation Solution
The implementation of a radio-frequency module with a module substrate having electronic components and external connection terminals, where a capacitor is strategically positioned between the power supply terminal and active circuits to enhance noise reduction by shortening wire lengths and reducing impedance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If capacitors are disposed on the reverse surface of the double-sided mounting board away from power supply terminals, then layout flexibility is improved, but noise reduction effectiveness deteriorates due to increased wire length and impedance
Solution Approach 1:
The patent applies local quality by differentiating the placement strategy for different types of capacitors. Bypass capacitors are positioned close to power supply terminals to minimize noise, while other capacitors can be placed elsewhere for layout flexibility. This localized optimization resolves the contradiction between overall layout flexibility and specific noise reduction requirements.
Solution Approach 2:
The patent segments the capacitor placement strategy into two categories: bypass capacitors that must be close to power supply terminals for noise reduction, and other capacitors that can be placed elsewhere for layout flexibility. This segmentation allows each type of capacitor to be optimized for its specific function, resolving the contradiction between layout flexibility and noise reduction effectiveness.
2Adaptability or versatility
If wire length between power supply terminal and capacitor is increased, then layout flexibility is improved, but wire impedance increases causing degraded noise reduction performance
Solution Approach 1:
The patent applies local quality by making the wire length between power supply terminals and bypass capacitors significantly shorter than other wire lengths in the circuit. This localized wire length optimization reduces impedance and improves noise reduction performance in the critical power supply path while maintaining overall layout flexibility for other components.
3Adaptability or versatility
If power supply terminal is positioned away from bypass capacitor, then design flexibility is improved, but noise interference increases due to longer connection path
Solution Approach 1:
The patent applies local quality by positioning power supply terminals close to bypass capacitors in the critical power supply paths where noise reduction is most important. This localized proximity optimization minimizes noise interference in the most sensitive areas while allowing other parts of the design to maintain flexibility for layout and signal routing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively mitigates noise interference and improves the performance of radio-frequency modules by enhancing noise reduction and reducing the degradation of bypass capacitors due to wire impedance.
Implementation Method 1
a capacitor coupled between a path connecting the power supply terminal to the active circuit and ground
Data Source
AI summary
A radio-frequency module includes a module substrate having major surfaces that are opposite to each other, a plurality of electronic components disposed at the major surface and at the major surface, and a plurality of post electrodes that are disposed at the major surface and that include a power supply terminal. The plurality of electronic components includes an integrated circuit that is disposed at the major surface and that includes a control circuit coupled to the power supply terminal. The plurality of electronic components also include a capacitor that is disposed at the major surface and that is coupled between the path connecting the power supply terminal to the control circuit and ground. The power supply terminal is disposed closer to the capacitor than any other post electrodes; and/or the capacitor is disposed closer to the power supply terminal than any other electronic component disposed at the major surface.