RF Module Carrier Assembly for Conformal Shielding Deposition
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Solution Overview
Problem
In the fabrication of radio-frequency (RF) modules, existing technologies face challenges in effectively shielding RF circuits from electromagnetic interference while allowing for precise processing of singulated units with conformal shielding layers.
Innovation Solution
A carrier assembly with a plate and adhesive layer is used to securely position RF packages, allowing for the application of conformal shielding layers on the upper surfaces and side walls while protecting the underside, utilizing a method that includes laser cutting of the adhesive layer to match the plate openings and accommodate ball grid arrays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a carrier assembly with adhesive layer is used to position packages, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The carrier assembly is segmented into distinct functional components: a plate with openings for positioning and an adhesive layer with patterned openings for securing packages. This segmentation allows each component to perform its specific function optimally while maintaining overall precision.
Solution Approach 2:
The adhesive layer acts as an intermediary between the plate and the packages, providing precise positioning through its patterned openings while simplifying the overall assembly process by enabling batch processing of multiple packages simultaneously.
2Object-affected harmful factors
If conformal shielding layers are applied to RF packages, then electromagnetic interference protection is improved, but manufacturing process complexity increases
Solution Approach 1:
Packages are pre-positioned on the carrier assembly with precise alignment before the conformal shielding deposition process. This preliminary positioning ensures that the shielding material is deposited uniformly and conformally on all exposed surfaces without requiring complex in-process adjustments.
Solution Approach 2:
The carrier assembly serves multiple functions: it positions packages, exposes specific surfaces for shielding, and facilitates batch processing. This multi-functionality reduces overall manufacturing complexity by consolidating several operations into a single fixture.
3Manufacturing precision
If the adhesive layer openings match the plate openings, then manufacturing precision is improved, but loss of time increases due to additional laser cutting step
Solution Approach 1:
The mechanical process of creating precisely matched openings in both the plate and adhesive layer is replaced with laser cutting technology. This substitution achieves superior alignment precision through digital control while reducing the time required compared to traditional mechanical machining and alignment methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient batch processing of RF modules with effective shielding, protecting the underside of packages and allowing full exposure of upper surfaces and side walls for metal deposition, facilitating high-volume processing with precision and tolerance in package positioning.
Implementation Method 1
an adhesive layer implemented on the first side of the plate... capable of providing an adhesive engagement between an underside perimeter portion of a package and a perimeter portion about the corresponding opening of the first side of the plate
Implementation Method 2
utilizing a method that includes laser cutting of the adhesive layer to match the plate openings
Implementation Method 3
allowing full exposure of upper surfaces and side walls for metal deposition... deposition material being introduced to the upper surface and side walls of the package. The deposition material can include sputtered metal
Data Source
AI summary
Shielded module fabrication methods and devices. In some embodiments, a carrier assembly can be provided for processing of packaged modules. The carrier assembly can include a plate having a first side that defines a plurality of openings, and an adhesive layer implemented on the first side of the plate. The adhesive layer can define a plurality of openings arranged to substantially match the openings of the plate, with each opening of the adhesive layer being dimensioned such that the adhesive layer is capable of providing an adhesive engagement between an underside perimeter portion of a package and a perimeter portion about the corresponding opening of the first side of the plate.