RF Module Substrate Layout for Compact Multiband Packaging
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Solution Overview
Problem
Existing radio-frequency modules for mobile communication devices face challenges in reducing size without increasing height, particularly with the complexity of multiband operation.
Innovation Solution
The design includes multiple electronic components and external connection terminals arranged on module substrates with specific configurations, where chip inductors are strategically placed to minimize height while optimizing component placement across different tiers, ensuring only first electronic components with transistors are disposed at the lower surface, reducing the module's overall size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple electronic components are arranged on module substrates to reduce the module size, then the area is reduced, but the height increases due to component stacking requirements
Solution Approach 1:
The patent transitions from planar arrangement to three-dimensional arrangement by placing chip inductors between the two module substrates (first and second module substrates). This vertical placement utilizes the height dimension to accommodate components that would otherwise require additional planar space, thereby reducing the overall module area while controlling height increase through strategic component positioning.
Solution Approach 2:
The patent embeds chip inductors within the module substrate stack, specifically positioning them between the first and second module substrates. This nesting approach integrates components into the existing structure rather than adding external layers, allowing multiple components to coexist in a compact configuration that reduces overall module footprint.
2Area of stationary object
If chip inductors are placed between module substrates to optimize space, then the planar area is reduced, but the manufacturing complexity increases
Solution Approach 1:
The patent divides the module into distinct layers: first module substrate, chip inductors, and second module substrate. This segmentation allows each component type to be positioned and manufactured separately before assembly, simplifying the overall manufacturing process despite the three-dimensional arrangement. The clear layering provides manufacturing guidance and facilitates quality control.
Solution Approach 2:
The patent applies different component placement strategies to different locations: chip inductors are specifically placed between the module substrates where space is available, while other electronic components are arranged on the outer surfaces. This localized optimization allows the system to achieve compact planar area without uniformly increasing manufacturing complexity across all components.
3Volume of moving object
If electronic components are arranged to achieve compact size, then the module becomes more compact, but the heat dissipation becomes more difficult
Solution Approach 1:
By positioning chip inductors between the module substrates rather than stacking them vertically on top of each other, the patent creates internal air gaps and thermal pathways that facilitate heat dissipation. This three-dimensional arrangement distributes heat-generating components throughout the module volume, preventing heat concentration in a single location and improving thermal management in the compact design.
Data Source
AI summary
A radio-frequency module includes module substrates, multiple electronic components, and multiple external connection terminals. The module substrate has major surfaces that are opposite to each other. The module substrate has major surfaces that are opposite to each other. The module substrate is disposed such that the major surface faces the major surface. The multiple electronic components are disposed between the major surfaces, at the major surface, or at the major surface. The external connection terminals are disposed at the major surface. The multiple electronic components include one or more first electronic components each including at least a transistor and one or more second electronic components each not including any transistor. At the major surface, at least one of the one or more first electronic components is disposed, and the one or more second electronic components are not disposed.